15-80-0065

厂商：
MOLEX2
封装：
描述：
15-80-0065 - 2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shro...

数据手册：

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15-80-0065 数据手册

This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015800065 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76µm (30µ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating Documents: 3D Model Drawing (PDF) Packaging Specification (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Series Agency Certification CSA UL LR19980 E29179 General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits (maximum) Circuits Detail Color - Resin First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) No 6 6 6 Black No 94V-0 No No None Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.40 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 30 0.75 75 1.875 Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 70567Series Mates With 70450 Crimp Housing Polarized to Mating Part Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style Yes No Fully No No -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number 70567-0137 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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15-80-0065

1. 物料型号： - 型号：0015800065 - 状态：Active（活跃）

2. 器件简介： - 描述：2.54mm (.100") 间距 C-Grid® 插座，通孔无定位销，双排，垂直。 - 材料：铜合金，镀金（Au），选择性（Sn）PC尾镀层。

3. 引脚分配： - 电路（已加载）：6 - 最大电路数：6 - 电路细节颜色 - 树脂：6（黑色）

4. 参数特性： - 阻燃等级：94V-0 - 焊接合规性：无 - 金属材质：磷青铜 - 端子镀层：锡 - 树脂材料：高温热塑性塑料 - 排数：2 - 导向：垂直 - PCB尾长：0.130英寸（3.30毫米） - PCB厚度推荐：0.093英寸（2.40毫米） - 包装类型：管装 - 间距 - 接口：2.54mm（0.100英寸） - 镀层最小：配合（30微英寸，0.75微米），终止（75微英寸，1.875微米）

5. 功能详解： - 产品系列：70567 - 应用：线对板（Wire-to-Board） - 产品名称：C-Grid® - 物理特性：不可分离 - 极化到配合部件：是 - 极化到PCB：否 - 全覆盖：是 - 堆叠：否 - 表面安装兼容（SMC）：否 - 操作温度范围：-55°C至+105°C - 电气特性：每接触最大电流2.5A，最大电压250V

6. 应用信息： - 与70450压接式外壳配合使用。

7. 封装信息： - 封装规格：PK-70873-0018 - 产品规格：PS-70567 - 销售图纸：SDA-70567-

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