15-80-0067

厂商：
MOLEX2
封装：
描述：
15-80-0067 - 2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shro...

数据手册：

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15-80-0067 数据手册

This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015800067 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating, 3.81mm (.150") Inside Shroud to End Circuit Spacing Documents: 3D Model Drawing (PDF) Packaging Specification (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Series Agency Certification CSA UL LR19980 E29179 General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits (maximum) Circuits Detail Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) No 6 6 6 Black 25 No 94V-0 No No None Yes Brass, Phosphor Bronze Tin Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.36 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 150 3.75 150 Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 70567Series Mates With 70013 Interim Clip Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 3.75 No No Open Ends No Yes -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V DC Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number A-70567-0205 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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15-80-0067

物料型号： - 型号：0015800067

器件简介： - 描述：2.54mm (.100") 间距 C-Grid 头，通孔无定位销，双排直插，遮蔽式，耐高温，6路，锡(Sn)镀层，3.81mm (.150") 间距。 - 产品系列：70567 - 应用：线对板连接

引脚分配： - 电路数（已安装）：6 - 电路数（最大）：6

参数特性： - 颜色 - 树脂：黑色 - 耐久性（最大插拔次数）：25次 - 阻燃等级：94V-0 - 金属材质：黄铜，锡磷青铜 - 镀层 - 配合：锡 - 镀层 - 终止：锡 - 树脂材质：耐高温热塑性塑料 - 排数：2 - 垂直方向 - PCB 尾长：0.130英寸（3.30mm） - PCB厚度推荐：0.093英寸（2.36mm） - 包装类型：管装 - 间距 - 配合接口 (in)：0.100英寸（2.54mm） - 镀层最小 - 配合 (uin)：150 - 镀层最小 - 配合 (um)：3.75 - 镀层最小 - 终止 (uin)：150 - 镀层最小 - 终止 (um)：3.75

功能详解： - 无断路器：否 - 与配合件的钥匙配合：无 - 与配合件的锁扣：是 - 堆叠：否 - 表面贴装兼容（SMC）：是 - 工作温度范围：-55°C至+105°C - 终止接口样式：通孔 - 电气特性：最大电流每接触点2.5A，最大电压250V DC - 焊接过程数据：最大过程温度下持续时间5秒，无铅过程能力（仅限通孔）

应用信息： - 与70013型夹子配合使用

封装信息： - 包装规格：PK-70873-0018 - 产品规格：PS-70567 - 销售图纸：SDA-70567-

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