15-80-0081

厂商：
MOLEX2
封装：
描述：
15-80-0081 - 2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shro...

数据手册：

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15-80-0081 数据手册

This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015800081 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating Documents: 3D Model Drawing (PDF) Packaging Specification (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only Agency Certification UL E29179 General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits Detail Color - Resin First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Shrouded No 8 8 Black No 94V-0 No No None Yes Brass, Phosphor Bronze Tin Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.40 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 150 3.75 150 3.75 Yes No Fully EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 70567Series Mates With 70450 Crimp Housing Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No No -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number 705670002 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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15-80-0081

1. 物料型号： - 型号：0015800081 - 状态：Active（活跃）

2. 器件简介： - 描述：2.54mm (.100") 间距 C-Grid® 直插式无定位销双排立式带护罩，高温，8路，锡（Sn）镀层。 - 产品系列：70567 - 应用：线对板（Wire-to-Board）

3. 引脚分配： - 电路（已加载）：8路 - 引脚间距：0.100英寸（2.54mm）

4. 参数特性： - 颜色 - 树脂：黑色 - 阻燃等级：94V-0 - 金属材质：黄铜，磷青铜 - 镀层 - 接触：锡 - 镀层 - 终止：锡 - 树脂材质：高温热塑性塑料 - 行数：2 - 取向：垂直 - PCB厚度推荐：0.093英寸（2.40mm） - 引脚间距 - 接触界面：0.100英寸（2.54mm） - 镀层最小值：接触界面3.75微米，终止界面3.75微米 - 极化：对接触部分是，对PCB否

5. 功能详解： - 工作温度范围：-55°C至+105°C - 电气参数：最大电流每接触2.5A，最大电压250V - 焊接过程数据：适用于无铅焊接过程，波峰焊和选择性焊接（仅限直插式）

6. 应用信息： - 与70450型号压接式外壳配合使用 - 兼容表面贴装（SMC）

7. 封装信息： - 封装类型：管装 - 引脚长度：0.130英寸（3.30mm）

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