15-80-0087

15-80-0087

  • 厂商:

    MOLEX2

  • 封装:

  • 描述:

    15-80-0087 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shro...

  • 详情介绍
  • 数据手册
  • 价格&库存
15-80-0087 数据手册
This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015800087 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating, 3.81mm (.150") Inside Shroud to End Circuit Spacing Documents: 3D Model Packaging Specification (PDF) Drawing (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Series Agency Certification UL E29179 General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits (maximum) Circuits Detail Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) No 8 8 8 Black 25 No 94V-0 No No None Yes Brass, Phosphor Bronze Tin Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.36 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 150 3.75 150 3.75 Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 70567Series Mates With 70013 Interim Clip Polarized to Mating Part Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No No Open Ends No Yes -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V DC Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number A-70567-0206 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
15-80-0087
1. 物料型号: - 型号:0015800087 - 状态:Active - 描述:2.54mm (.100") 间距 C-Grid® 直插式双排垂直头,带护壳,高温,8路,锡(Sn)镀层,护壳内部到端路间距为3.81mm (.150")。

2. 器件简介: - 产品名称:物理断开电路(带负载)电路(最大)电路详细信息 - 颜色:黑色 - 耐用性:最大25次接插循环 - 阻燃等级:94V-0 - 材料:金属材质为黄铜、磷青铜,塑料部分为高温热塑性材料。

3. 引脚分配: - 双排,垂直方向,0.130英寸(3.30mm)PC尾长。

4. 参数特性: - 电气参数:最大电流每接触点2.5A,最大电压250V DC。 - 焊接过程数据:最大过程温度下持续时间为5秒,无铅焊接能力(仅限直插式)。

5. 功能详解: - 该产品符合欧盟RoHS、中国RoHS、ELV和RoHS标准,不含SVHC,无卤素状态未审核。 - 操作温度范围:-55°C至+105°C。

6. 应用信息: - 与70013型临时卡扣配合使用。 - 适用于表面贴装兼容(SMC)。

7. 封装信息: - 封装类型:PK-70873-0018 - 引脚间距:2.54mm(.100") - 镀层:最小镀锡层厚度为1.0微英寸(0.025微米)。
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