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15-80-0123

15-80-0123

  • 厂商:

    MOLEX2

  • 封装:

  • 描述:

    15-80-0123 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shro...

  • 详情介绍
  • 数据手册
  • 价格&库存
15-80-0123 数据手册
This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015800123 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38µm (15µ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating Documents: 3D Model Packaging Specification (PDF) Drawing (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Series Agency Certification UL E29179 General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits Detail Color - Resin First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB No 12 12 Black No 94V-0 No No None Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.40 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 15 0.375 75 1.875 Yes No Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 70567Series Mates With 70450 Crimp Housing Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style Fully No No -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number A-70567-0072 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
15-80-0123
1. 物料型号: - 型号:0015800123 - 状态:Active - 描述:2.54mm (.100") 间距 C-Grid® 插座,通孔无定位销,双排,垂直,带护罩,高温,12路,0.38µm (15µ") 金 (Au) 选择性电镀,锡 (Sn) PCB尾电镀。

2. 器件简介: - 产品名称:物理断开电路(带负载) - 电路细节:颜色 - 树脂,首次配合/最后断开,阻燃性能符合 Glow-Wire 标准,与配合件的配合指南,金属材质,电镀,配合件的电镀,尾端电镀,树脂数量:双排,PCB定位器,PCB保持,PCB厚度推荐值(英寸/毫米),包装类型,配合界面间距(英寸/毫米),电镀最小值:配合(微英寸/微米),电镀最小值:尾端(微英寸/微米)。

3. 引脚分配: - 引脚数量:12 - 引脚颜色:黑色 - 引脚材料:黄铜,磷青铜 - 引脚电镀:金,锡 - 引脚高温性能:是

4. 参数特性: - 阻燃等级:94V-0 - 是否有锁定机制:是 - 材料:金属 - 黄铜,磷青铜,电镀 - 金,锡,高温工程塑料 - 行数:2 - PCB尾长(英寸/毫米):0.130/3.30 - PCB定位器:有 - PCB保持:有 - 推荐PCB厚度(英寸/毫米):0.093/2.40 - 包装类型:管状 - 配合界面间距(英寸/毫米):0.100/2.54 - 尾端电镀:金,锡

5. 功能详解: - 环境合规性:符合欧盟RoHS、中国RoHS、ELV和RoHS,REACH SVHC不含SVHC,无卤素状态未审核。 - 电气特性:最大电流每接触点2.5A,最大电压250V,无铅焊接过程数据,最大处理温度245°C。

6. 应用信息: - 与70450压接外壳配合使用。

7. 封装信息: - 封装规格:PK-70873-0018 - 产品规格:PS-70567 - 销售图纸:SDA-70567-
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