15-80-0181

厂商：
MOLEX2
封装：
描述：
15-80-0181 - 2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shro...

数据手册：

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15-80-0181 数据手册

This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015800181 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, Tin (Sn) Plating Documents: 3D Model Drawing (PDF) Packaging Specification (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only Agency Certification CSA UL LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits Detail Color - Resin First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB No 18 18 Black No 94V-0 No No None Yes Brass, Phosphor Bronze Tin Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.40 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 150 3.75 150 3.75 Yes No Search Parts in this Series 70567Series Mates With 70450 Crimp Housing Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style Fully No No -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number 70567-0007 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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15-80-0181

1. 物料型号： - 型号：0015800181 - 状态：Active - 描述：2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical

2. 器件简介： - 产品名称：C-Grid® - 概述：2.54mm (.100") Pitch C-Grid Header, Through Hole without Peg, I Shrouded, High Temperature, 18 Circuits, Tin (Sn) Plating

3. 引脚分配： - 电路数：18 - 引脚间距：2.54mm (.100") Pitch

4. 参数特性： - 材料：金属部分为黄铜和磷青铜，塑料部分为高温热塑性塑料 - 耐燃等级：94V-0 - 极化：与配合件极化，与PCB无极化

5. 功能详解： - 应用：Wire-to-Board - 锁扣：是，与配合件有锁扣 - 极化：是，与配合件极化 - PCB厚度推荐：0.093英寸（2.40毫米）

6. 应用信息： - 工作温度范围：-55°C到+105°C - 最大电流每接触点：2.5A - 焊接过程数据：最大过程温度245°C，持续时间5秒

7. 封装信息： - 封装类型：Tube - 引脚间距：2.54mm (.100") Pitch - 封装细节：双排，垂直方向

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