15-80-0243

15-80-0243

  • 厂商:

    MOLEX2

  • 封装:

  • 描述:

    15-80-0243 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shro...

  • 详情介绍
  • 数据手册
  • 价格&库存
15-80-0243 数据手册
This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015800243 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.38µm (15µ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating Documents: 3D Model Drawing (PDF) Packaging Specification (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Series Agency Certification CSA UL LR19980 E29179 General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits Detail Color - Resin First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part No 24 24 Black No 94V-0 No No None Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.40 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 15 0.375 75 1.875 Yes Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 70567Series Mates With 70450 Crimp Housing Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No Fully No No -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number A-70567-0078 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
15-80-0243
1. 物料型号: - 型号:0015800243 - 状态:Active(活跃) - 描述:2.54mm(.100")间距C-Grid Header,通孔无定位销,双排防呆,耐高温,24路,0.38um(15")金(Au)选择性镀层。

2. 器件简介: - 产品系列:70567 - 应用:线对板(Wire-to-Board) - 产品名称:C-GridR - 物理特性:无断开,24路,黑色树脂。

3. 引脚分配: - 引脚数量:24 - 引脚排列:垂直双排

4. 参数特性: - 材料:金属部分为黄铜和磷青铜,接触镀金,终止镀锡。 - 耐高温热塑性塑料。 - 引脚间距:2.54mm(.100") - PCB厚度推荐:0.093英寸(2.40mm) - 包装类型:管装 - 镀层:接触部位最小0.375um(15"),终止部位最小1.875um(75")

5. 功能详解: - 极性:与配合件极性匹配 - 锁紧:与配合件锁紧 - 表面安装兼容性:不兼容 - 工作温度范围:-55°C至+105°C - 电气特性:最大电流2.5A,最大电压250V

6. 应用信息: - 配合件:与70450号压接外壳配合使用 - 极性:不与PCB极性匹配 - 封装:完全防呆

7. 封装信息: - 封装类型:通孔 - 包装规格:PK-70873-0018 - 产品规格:PS-70567 - 销售图纸:SDA-70567-
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