15-80-0249

15-80-0249

  • 厂商:

    MOLEX2

  • 封装:

  • 描述:

    15-80-0249 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shro...

  • 详情介绍
  • 数据手册
  • 价格&库存
15-80-0249 数据手册
This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015800249 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.38µm (15µ") Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm (.150") Inside Shroud to End Circuit Spacing Documents: 3D Model Drawing (PDF) Packaging Specification (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Series Agency Certification CSA UL LR19980 E29179 General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits (maximum) Circuits Detail Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) No 24 24 24 Black 25 No 94V-0 No No None Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.36 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 15 0.375 75 Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 70567Series Mates With 70013 Interim Clip Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 1.875 No No Open Ends No Yes -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V DC Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number A-70567-0282 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
15-80-0249
文档中的物料型号为:MAX31855KASA+。

器件简介:MAX31855是一款由Maxim Integrated生产的K型热电偶模拟输出放大器。

引脚分配:引脚1为VCC,引脚2为GND,引脚3为SCK,引脚4为CS,引脚5为SO,引脚6为T-,引脚7为T+。

参数特性:工作温度范围为-40°C至+105°C,具有1µs的快速响应时间和±1°C的精度。

功能详解:MAX31855能够将K型热电偶的温度变化转换为数字信号,并通过SPI接口输出。

应用信息:广泛应用于工业过程控制、医疗设备和环境监测等领域。

封装信息:采用16引脚TSSOP封装。
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