15-80-0267

15-80-0267

  • 厂商:

    MOLEX2

  • 封装:

  • 描述:

    15-80-0267 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shro...

  • 详情介绍
  • 数据手册
  • 价格&库存
15-80-0267 数据手册
This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015800267 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating, 3.81mm (.150") Inside Shroud to End Circuit Spacing Documents: 3D Model Drawing (PDF) Packaging Specification (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Series Agency Certification UL E29179 General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits (maximum) Circuits Detail Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) No 26 26 26 Black 25 No 94V-0 No No None Yes Brass, Phosphor Bronze Tin Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.36 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 150 3.75 150 3.75 Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 70567Series Mates With 70013 Interim Clip Polarized to Mating Part Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No No Open Ends No Yes -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V DC Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number A-70567-0215 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
15-80-0267
1. 物料型号: - 型号:0015800267 - 状态:Active - 描述:2.54mm (.100") 间距 C-Grid® 通孔式双排直插式带护壳高温度、26路、锡(Sn)镀层、护壳内部到端路3.81mm (.150")间距。

2. 器件简介: - 产品名称:Physical Breakaway Circuits (Loaded) - 电路数最大值:26 - 颜色:黑色 - 耐久性:25次最大插拔循环 - 防火等级:94V-0 - 材料:金属材质为黄铜、磷青铜,塑料部分为高温热塑性材料。

3. 引脚分配: - 双排垂直布局,0.130英寸(3.30mm)的引脚长度。

4. 参数特性: - 最大电流每接触点:2.5A - 最大电压:250V DC - 焊接过程数据:最大过程温度245°C,持续时间5秒。

5. 功能详解: - 该产品为通过UL认证的C-Grid®系列连接器,适用于线对板连接。 - 特点包括无极性、开端、不可堆叠、兼容表面安装(SMC)。

6. 应用信息: - 工作温度范围:-55°C至+105°C。 - 适用于需要高耐久性和耐高温环境的应用。

7. 封装信息: - 封装类型:管装。 - 引脚间距:2.54mm。 - 推荐PCB厚度:推荐为0.100英寸(2.54mm)。 - 包装规格:PK-70873-0018。
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