15-80-0369

厂商：
MOLEX2
封装：
描述：
15-80-0369 - 2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shro...

数据手册：

下载15-80-0369.pdf

立即购买

详情介绍
数据手册
价格&库存

15-80-0369 数据手册

This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015800369 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, 0.38µm (15µ") Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm (.150") Inside Shroud to End Circuit Spacing Documents: 3D Model Drawing (PDF) Packaging Specification (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Series Agency Certification UL E29179 General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits (maximum) Circuits Detail Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) No 36 36 36 Black 25 No 94V-0 No No None Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.36 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 15 0.375 75 1.875 Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 70567Series Mates With 70013 Interim Clip Polarized to Mating Part Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No No Open Ends No Yes -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V DC Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number A-70567-0288 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

下载 PDF

15-80-0369

1. 物料型号： - 型号：0015800369 - 状态：Active（活跃） - 描述：2.54mm（.100"）间距C-Grid® 直插式双排垂直头，带护套，高温，36路，0.38µm（15µ"）金（Au）选择性镀层，锡（Sn）PC尾镀层，3.81mm（.150"）护套内端到端路间距。

2. 器件简介： - 产品名称：PCB Headers 70567 Wire-to-Board C-Grid® - 认证：UL E29179 - 环保合规：符合EU RoHS、中国RoHS、ELV和RoHS，REACH SVHC不含SVHC，无卤素状态未审核。

3. 引脚分配： - 路数：36路

4. 参数特性： - 颜色：黑色 - 耐久性：最大25次配对周期 - 阻燃等级：94V-0 - 材料：金属材质为黄铜、磷青铜，镀层为金、锡，塑料材质为高温热塑性材料 - 行数：2行 - PCB尾长：0.130英寸（3.30mm） - PCB定位器：有 - PCB保持：有 - PCB厚度推荐：0.093英寸（2.36mm） - 包装类型：管装 - 接口间距：2.54mm（0.100英寸） - 镀层：配对最小0.375µin（15µm），终止最小0.375µin（15µm）

5. 功能详解： - 极性：不对配对部分极性，不对PCB极性 - 护套：开放端 - 堆叠：不可堆叠 - 表面贴装兼容（SMC）：是 - 工作温度范围：-55°C至+105°C - 电气特性：最大电流每接触2.5A，最大电压250V DC - 焊接过程数据：最大过程温度下持续时间5秒，无铅过程能力（TH only），最大过程温度245°C

6. 应用信息： - 适用于物理断开电路（已加载）电路（最大）电路详细信息

7. 封装信息： - 封装规格：PK-70873-0018 - 产品规格：PS-70567 - 销售图纸：SDA-70567-

15-80-0369 价格&库存

-> 查询更多价格&库存

很抱歉，暂时无法提供与“15-80-0369”相匹配的价格&库存，您可以联系我们找货

免费人工找货