15-80-0423

厂商：
MOLEX2
封装：
描述：
15-80-0423 - 2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shro...

数据手册：

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15-80-0423 数据手册

This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015800423 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, 0.38µm (15µ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating Documents: 3D Model Packaging Specification (PDF) Drawing (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Series Agency Certification CSA UL LR19980 E29179 General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits Detail Color - Resin First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Polarized to Mating Part Polarized to PCB Shrouded Stackable No 42 42 Black No 94V-0 No No None Yes Brass, Phosphor Bronze Gold High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.40 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 15 0.38 Yes No Fully No Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 70567Series Mates With 70450 Crimp Housing Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number A-70567-0087 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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15-80-0423

1. 物料型号： - 型号：0015800423 - 状态：Active（活跃） - 符合欧盟RoHS、中国RoHS、ELV和RoHS标准，不含SVHC，无卤素，尚未审查。

2. 器件简介： - 产品描述：2.54mm（.100"）间距C-Grid® 插座，通孔无定位销，双屏蔽，高温，42路，0.38um（15"）金（Au）锡（Sn）PC尾镀层。

3. 引脚分配： - 电路（已加载）：42路 - 电路细节：42路

4. 参数特性： - 无断裂：否 - 颜色-树脂：黑色 - 阻燃性：94V-0 - 材料-金属：黄铜，磷青铜 - 材料-镀层：金 - 材料-树脂：高温热塑性塑料 - 行数：2 - 导向-配合部件：否 - 锁紧-配合部件：是 - 极化-配合部件：是 - 全屏蔽：完全 - 堆叠：否

5. 功能详解： - 产品系列：70567 - 应用：线对板（Wire-to-Board） - 电气：最大电流每接触2.5A，最大电压250V - 焊接过程数据：无铅焊接，最大周期次数1，245秒

6. 应用信息： - 与70450压接式外壳配合使用 - 工作温度范围：-55°C至+105°C - 表面贴装兼容（SMC）

7. 封装信息： - 包装类型：管装 - 引脚间距-配合接口（in）：0.100 In - 引脚间距-配合接口（mm）：2.54 mm - 镀层最小：配合（uin）：15 - 镀层最小：配合（um）：0.38

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