15-80-0705

厂商：
MOLEX2
封装：
描述：
15-80-0705 - 2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shro...

数据手册：

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数据手册
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15-80-0705 数据手册

This document was generated on 05/26/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015800705 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.76µm (30µ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating Documents: 3D Model Drawing (PDF) Packaging Specification (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Series Agency Certification CSA UL LR19980 E29179 General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits Detail Color - Resin First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part No 70 70 Black No 94V-0 No No None Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.40 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 30 0.76 75 1.875 Yes Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 70567Series Mates With 70450 Crimp Housing Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No Fully No No -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number 70567-0169 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/26/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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15-80-0705

1. 物料型号： - 零件编号：0015800705

2. 器件简介： - 描述：活跃的cgrid sl产品，锡（Sn）PC尾镀层。 - 产品系列：70567。 - 应用概述：线对板（Wire-to-Board）。 - 产品名称：C-Grid。

3. 引脚分配： - 电路（已加载）：70。 - 无断裂（Breakaway）：否。 - 排数：2。 - 垂直方向（Orientation）：垂直。

4. 参数特性： - 颜色 - 树脂：黑色。 - 阻燃等级：94V-0。 - 金属材质：黄铜，锡磷青铜。 - 镀层材质：金。 - 镀层终止材质：锡。 - 树脂材质：高温热塑性塑料。 - PC尾长（英寸）：0.130 In。 - PCB厚度推荐（英寸）：0.093 In。 - 间距 - 接口（英寸）：0.100 In。 - 镀层最小 - 接口（微米）：0.76。 - 极性化到配对部件：是。

5. 功能详解： - 操作温度范围：-55°C至+105°C。 - 最大每接触电流：2.5A。 - 最大电压：250V。 - 焊接过程数据：最大过程温度持续时间5秒，无铅过程能力（TH only），最大过程温度245°C。

6. 应用信息： - 与70450 Crimp Housing配合使用。

7. 封装信息： - 包装类型：管装。 - 间距 - 接口（毫米）：2.54 mm。 - 镀层最小 - 接口（微米）：30。 - 极化到PCB：否。 - 全覆盖（Shrouded）：完全。 - 通孔兼容（TH）：是。

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