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15-80-1161

15-80-1161

  • 厂商:

    MOLEX2

  • 封装:

  • 描述:

    15-80-1161 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shro...

  • 详情介绍
  • 数据手册
  • 价格&库存
15-80-1161 数据手册
This document was generated on 05/26/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015801161 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76µm (30µ") Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm (.150") Inside Shroud to End Circuit Spacing Documents: 3D Model Packaging Specification (PDF) Drawing (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Series Agency Certification UL E29179 General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits (maximum) Circuits Detail Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) No 16 16 16 Black 25 No 94V-0 No No None Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.36 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 30 0.75 75 1.875 Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 70567Series Mates With 70013 Interim Clip Polarized to Mating Part Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No No Open Ends No Yes -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V DC Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number A-70567-0346 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/26/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
15-80-1161
1. 物料型号: - 型号:0015801161 - 状态:Active(活跃)

2. 器件简介: - 描述:2.54mm(.100")间距C-Grid®插座,通孔无定位销,双排,垂直,带护罩,高温,16路,0.76µm(30µ")金(Au)选择性镀层,锡(Sn)PC尾镀层,3.81mm(.150")护罩内端到端电路间距。

3. 引脚分配: - 引脚数量:16 - 引脚间距:2.54mm(.100")

4. 参数特性: - 颜色:黑色 - 耐久性(最大插拔次数):25次 - 阻燃等级:94V-0 - 金属材质:黄铜,磷青铜 - 镀层:金,锡 - 塑料材质:高温热塑性

5. 功能详解: - 该产品符合物理断开电路(已装载)的最大电路数和详细颜色。 - 符合UL认证,具有多种环保合规性,如EU RoHS、中国RoHS、ELV和RoHS。

6. 应用信息: - 与70013型号的中间夹配合使用。 - 极化到配合件否。 - 护罩开放端否。 - 堆叠否。 - 表面安装兼容(SMC)是。 - 工作温度范围:-55°C至+105°C。 - 电气特性:每个接触点最大电流2.5A,最大电压250V DC。

7. 封装信息: - 引脚长度(英寸):0.130 In - 引脚长度(mm):3.30 mm - 是否有PCB定位器:是 - PCB保持:是 - 推荐PCB厚度(英寸):0.100 In - 推荐PCB厚度(mm):2.54 mm - 包装类型:未提供具体信息。
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