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15-91-2055

15-91-2055

  • 厂商:

    MOLEX2

  • 封装:

  • 描述:

    15-91-2055 - 2.54mm (.100) Pitch SLâ„¢ Wire-to-Board Header, Low Profile, Surface Mount, Single Row,...

  • 详情介绍
  • 数据手册
  • 价格&库存
15-91-2055 数据手册
This document was generated on 04/09/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0015912055 Active 2.54mm (.100") Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, .120" Pocket, Shrouded, with Press-fit Plastic Peg, 5 Circuits, 0.38µm (15µ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating Documents: 3D Model Packaging Specification (PDF) Drawing (PDF) Product Specification PS-70400 (PDF) Product Specification PS-70541 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL LR19980 E29179 General Product Family Series Application Product Name PCB Headers 70634 Wire-to-Board SL™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Shrouded Stackable Temperature Range - Operating Termination Interface: Style No 5 5 Black 50 94V-0 No Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 1 Right Angle Yes Yes 0.062 In 1.60 mm Tube 0.100 In 2.54 mm 15 0.375 75 1.875 Yes Yes Fully No -40°C to +105°C Surface Mount Search Parts in this Series 70634Series Mates With 70066n , 70066g , 70430g , 70400g Housing Electrical Current - Maximum per Contact 3A Voltage - Maximum 250V Solder Process Data Lead-free Process Capability Process Temperature max. C Reflow Capable (SMT only) 260 Material Info Old Part Number 70634-0039 Reference - Drawing Numbers Product Specification Sales Drawing PS-70400, PS-70541 SDA-70634-**** This document was generated on 04/09/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
15-91-2055
物料型号: - 型号:0015912055 - 状态:Active(活跃)

器件简介: - 描述:2.54mm (.100") 间距 SLTM 线对板头部,低轮廓,表面贴装排列,直角,.120" 口袋,带护套,配备压配合塑料销钉,5路 0.38um (15") 金 (Au) 选择性镀层,锡 (Sn) PC尾镀层。

引脚分配: - 电路(已加载):5 - 电路(最大):5

参数特性: - 断路器:否 - 颜色 - 树脂:黑色 - 耐用性(最大插拔次数):50 - 耐燃性:94V-0 - 锁扣与配合部件:是 - 金属材质:黄铜,锡磷青铜 - 镀层材质 - 配合:金 - 镀层材质 - 终止:锡 - 树脂材质:高温热塑性塑料 - 排数:1 - 取向:直角 - PCB定位器:是 - PCB保持:是 - PCB厚度推荐(英寸):0.062 In - PCB厚度推荐(毫米):1.60 mm - 包装类型:管装 - 配合界面间距(英寸):0.100 In - 配合界面间距(毫米):2.54 mm - 镀层最小 - 配合(微英寸):15 - 镀层最小 - 配合(微米):0.375 - 镀层最小 - 终止(微英寸):75 - 镀层最小 - 终止(微米):1.875 - 极化与配合部件:是 - 极化与PCB:是 - 护套:完全 - 堆叠:否 - 工作温度范围:-40°C至+105°C - 终止界面:表面贴装风格 - 电气:每接触最大电流3A

功能详解: - 提供了详细的物理和电气特性,包括配合界面间距、PCB厚度推荐、排数、取向、PCB定位器、PCB保持、包装类型等。

应用信息: - 产品家族:PCB头部 - 系列:70634 - 应用:线对板

封装信息: - 封装类型:直角,表面贴装头部,带PCB销钉
15-91-2055 价格&库存

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