15-97-7023

15-97-7023

  • 厂商:

    MOLEX2

  • 封装:

  • 描述:

    15-97-7023 - 4.20mm (.165) Pitch Mini-Fit TPAâ„¢ Header, Dual Row, Vertical, with Snap-in Plastic Pe...

  • 详情介绍
  • 数据手册
  • 价格&库存
15-97-7023 数据手册
This document was generated on 05/26/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015977023 Active minifit_tpa 4.20mm (.165") Pitch Mini-Fit TPA™ Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 2 Circuits, Tin (Sn) Plating, without Drain Holes Documents: 3D Model Drawing (PDF) Product Specification PS-5556-003 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 R72081037 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA TUV UL General Product Family Series Application Comments PCB Headers 30069 Wire-to-Board Current = 13A max. per circuit when header is mated to a receptacle loaded with 45750 Mini-Fit Plus HCS™ Crimp Terminal Crimpted to to 16 AWG wire. . See Molex product specification PS-45750-001 for additional current de-rating information.. Square Pin, Solder Type, High Vibration Application minifit_tpa Mini-Fit TPA™ Overview Product Name Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) No 2 2 Black 30 No 94V-0 No No None Yes Brass Tin Tin Polyester 2 Vertical Yes Yes 0.070 In 1.80 mm Tray 0.165 In 4.20 mm 0.165 In 4.20 mm 35 Search Parts in this Series 30069Series Mates With 30067 Mini-Fit TPA™ Receptacle Housing Use With Mini-Fit TPA™ Receptacle Housing 30071 , 30072 Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 0.90 35 0.90 Yes Yes Partial No No -40°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 13A 600V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 Wave Capable (TH only) 1 235 Material Info Old Part Number 30069-02C1 Reference - Drawing Numbers Product Specification Sales Drawing PS-5556-003 SDA-30069-**** This document was generated on 05/26/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
15-97-7023
1. 物料型号: - 型号:0015977023 - 状态:Active - 描述:minifit_tpa,Peg PCB Lock,2 Circuits,Tin (Sn) Plating,without Drain Holes

2. 器件简介: - 产品系列:30069 Wire-to-Board - 产品名称:Mini-Fit TPATM - 应用注释:最大电流每电路13A,当插座接合时 - 概述:高振动应用minifit_tpa

3. 引脚分配: - 电路数(最大):2 - 引脚排列:垂直 - PCB定位:是 - PCB保持:是

4. 参数特性: - 颜色 - 树脂:黑色 - 耐久性(最大接合周期):30 - 阻燃性:94V-0 - 镀层 - 接合最小:35uin(0.90um) - 镀层 - 终止最小:35uin(0.90um)

5. 功能详解: - 与Mating Part锁定:是 - 与PCB极化:是 - 部分屏蔽:是 - 堆叠:否 - 表面安装兼容(SMC):否,-40°C至+105°C

6. 应用信息: - 最大每接触电流:13A - 最大电压:600V - 焊接过程数据:最大过程温度235°C,持续时间5秒

7. 封装信息: - 包装类型:Tray - 间距 - 接合界面:0.165英寸(4.20mm) - 间距 - 终止界面:0.165英寸(4.20mm) - PCB厚度推荐:0.070英寸(1.80mm)
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