30069-10C1

30069-10C1

  • 厂商:

    MOLEX2

  • 封装:

  • 描述:

    30069-10C1 - 4.20mm (.165) Pitch Mini-Fit TPA™ Header, Dual Row, Vertical, with Snap-in Plastic Peg ...

  • 详情介绍
  • 数据手册
  • 价格&库存
30069-10C1 数据手册
This document was generated on 05/26/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015977103 Active minifit_tpa 4.20mm (.165") Pitch Mini-Fit TPA™ Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 10 Circuits, Tin (Sn) Plating, without Drain Holes Documents: 3D Model Drawing (PDF) Product Specification PS-5556-003 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 R72081037 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA TUV UL General Product Family Series Application Comments PCB Headers 30069 Wire-to-Board Current = 13A max. per circuit when header is mated to a receptacle loaded with 45750 Mini-Fit Plus HCS™ Crimp Terminal Crimpted to to 16 AWG wire. . See Molex product specification PS-45750-001 for additional current de-rating information.. Square Pin, Solder Type, High Vibration Application minifit_tpa Mini-Fit TPA™ Overview Product Name Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) No 10 10 Black 30 No 94V-0 No No None Yes Brass Tin Tin Polyester 2 Vertical Yes Yes 0.070 In 1.80 mm Tray 0.165 In 4.20 mm 0.165 In 4.20 mm 35 Search Parts in this Series 30069Series Mates With 30067 Mini-Fit TPA™ Receptacle Housing Use With Mini-Fit TPA™ Receptacle Housing 30071 , 30072 Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 0.90 35 0.90 Yes Yes Partial No No -40°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 13A 600V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 Wave Capable (TH only) 1 235 Material Info Old Part Number 30069-10C1 Reference - Drawing Numbers Product Specification Sales Drawing PS-5556-003 SDA-30069-**** This document was generated on 05/26/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
30069-10C1
1. 物料型号: - 型号:0015977103 - 状态:Active(活跃) - 描述:4.20mm(-165)Pitch Mini-it TPA™ Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 10 Circuits, Tin (Sn) Plating, without Drain Holes(双排,垂直,带快装塑料卡扣PCB锁,10路,锡(Sn)镀层,无排水孔)

2. 器件简介: - 产品系列:30069 - 产品名称:Mini-Fit TPATM - 应用:Wire-to-Board(线对板) - 特点:Square Pin, Solder Type, High Vibration Application(方针,焊接类型,高振动应用)

3. 引脚分配: - 电路数量(已加载):10 - 最大电路数量:10 - 引脚间距:Mating Interface(配合界面)和Termination Interface(终止界面)均为0.165英寸(4.20毫米)

4. 参数特性: - 电流 - 每个接触点最大:13A - 电压 - 最大:600V - 焊接过程数据:最大过程温度235°C,持续时间5秒,波峰焊能力(仅限TH)

5. 功能详解: - 无极性:是 - 部分屏蔽:是 - 堆叠:否 - 表面贴装兼容(SMC):否,工作温度范围-40°C至+105°C

6. 应用信息: - 配合使用Mini-Fit TPA™ Receptacle Housing 30067 - 使用Mini-Fit TPA™ Receptacle Housing 30071, 30072

7. 封装信息: - 封装类型:Tray(托盘) - PCB厚度推荐:0.070英寸(1.80毫米) - 引脚数:2排 - 垂直方向:是 - PCB定位:是 - PCB保持:是
30069-10C1 价格&库存

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