70567-0011

70567-0011

  • 厂商:

    MOLEX2

  • 封装:

  • 描述:

    70567-0011 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrou...

  • 详情介绍
  • 数据手册
  • 价格&库存
70567-0011 数据手册
This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015800261 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating Documents: 3D Model Drawing (PDF) Packaging Specification (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only Agency Certification CSA UL LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits Detail Color - Resin First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB No 26 26 Black No 94V-0 No No None Yes Brass, Phosphor Bronze Tin Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.40 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 150 3.75 150 3.75 Yes No Search Parts in this Series 70567Series Mates With 70450 Crimp Housing Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style Fully No No -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number 70567-0011 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
70567-0011
1. 物料型号: - 型号:0015800261 - 状态:Active(活跃) - 描述:2.54mm(.100")Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Active

2. 器件简介: - 产品家族:PCB Headers - 系列:70567 - 应用:Wire-to-Board - 产品名称:C-Grid® - 物理特性:无断裂,26个电路,黑色树脂,无首次配合/最后断裂,94V-0阻燃等级,无灼热丝合规性,无导向配合件,无键控配合件,有锁配合件,金属材质为黄铜和磷青铜,镀层材质为锡,树脂材质为高温热塑性塑料,双排,垂直方向。

3. 引脚分配: - 电路(已加载):26 - 电路细节:26

4. 参数特性: - 无断裂:否 - 电路数:26 - 树脂颜色:黑色 - 阻燃等级:94V-0 - 镀层最小厚度(配合):150微英寸(3.75微米) - 镀层最小厚度(终止):150微英寸(3.75微米) - 极化到配合件:是 - 极化到PCB:否

5. 功能详解: - 该器件为2.54mm(.100")间距的C-Grid®插座,适用于线对板连接,具有26个电路,垂直安装,双排,无定位销,有锁紧功能。

6. 应用信息: - 应用:线对板连接 - 包装类型:管装

7. 封装信息: - 引脚间距(配合接口):2.54mm - 引脚间距(终止接口):2.54mm - PCB厚度推荐:0.093英寸(2.40mm) - PCB定位器:无 - PCB保持:是
70567-0011 价格&库存

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