70567-0012

70567-0012

  • 厂商:

    MOLEX2

  • 封装:

  • 描述:

    70567-0012 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrou...

  • 详情介绍
  • 数据手册
  • 价格&库存
70567-0012 数据手册
This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015800281 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating Documents: 3D Model Drawing (PDF) Packaging Specification (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only Agency Certification CSA UL LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits Detail Color - Resin First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB No 28 28 Black No 94V-0 No No None Yes Brass, Phosphor Bronze Tin Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.40 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 150 3.75 150 3.75 Yes No Search Parts in this Series 70567Series Mates With 70450 Crimp Housing Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style Fully No No -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number 70567-0012 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
70567-0012
1. 物料型号: - 型号:0015800281 - 状态:Active - 系列:70567

2. 器件简介: - 产品名称:C-Grid® - 描述:2.54mm (.100") 间距 C-Grid® 插座,通孔无定位销,双排,垂直,1个护套,高温,28电路,锡(Sn)镀层。

3. 引脚分配: - 电路(已加载):28 - 排数:2

4. 参数特性: - 无断裂:否 - 颜色 - 树脂:黑色 - 阻燃等级:94V-0 - 极化:是(对于配合部件)和否(对于PCB)

5. 功能详解: - 应用:线对板连接 - 配合部件:与70450压接式外壳配合使用

6. 应用信息: - 工作温度范围:-55°C至+105°C - 最大电流每接触点:2.5A

7. 封装信息: - 封装类型:通孔 - 引脚间距 - 配合接口 (in):0.100 - 引脚间距 - 配合接口 (mm):2.54 - 镀层最小厚度 - 配合 (uin):150 - 镀层最小厚度 - 配合 (um):3.75
70567-0012 价格&库存

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