70567-0147

厂商：
MOLEX2
封装：
描述：
70567-0147 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrou...

数据手册：

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70567-0147 数据手册

This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015800265 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.76µm (30µ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating Documents: 3D Model Drawing (PDF) Packaging Specification (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Series Agency Certification CSA UL LR19980 E29179 General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits (maximum) Circuits Detail Color - Resin First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) No 26 26 26 Black No 94V-0 No No None Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.40 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 30 0.75 75 1.875 Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 70567Series Mates With 70450 Crimp Housing Polarized to Mating Part Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style Yes No Fully No No -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number 70567-0147 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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70567-0147

1. 物料型号： - 型号：0015800265 - 状态：Active（活跃）

2. 器件简介： - 描述：2.54mm (.100") 间距 C-Grid® 公头，通孔无定位销，双排，垂直方向。 - 特性：遮蔽式、耐高温、26路、0.76um（30"）金（Au）镀锡（Sn）PC尾镀层。

3. 引脚分配： - 引脚数量（已装载）：26 - 最大引脚数量：26 - 引脚细节：26个引脚

4. 参数特性： - 产品家族：PCB公头 - 系列：70567 - 应用：线对板（Wire-to-Board） - 物理特性：不可分离 - 颜色 - 树脂：黑色 - 阻燃等级：94V-0 - 金属材质 - 电镀：黄铜、磷青铜金 - 电镀终止：锡 - 树脂材质：耐高温热塑性塑料 - 行数：2 - 方向：垂直 - PCB厚度推荐（英寸）：0.093 - PCB厚度推荐（毫米）：2.40 - 包装类型：管装 - 间距 - 接口（英寸）：0.100 - 间距 - 接口（毫米）：2.54 - 镀层最小值：接口（um）0.75、终止（um）1.875

5. 功能详解： - 该产品符合欧盟RoHS、中国RoHS、ELV和RoHS指令，不含SVHC，无卤素状态未审核。

6. 应用信息： - 适用于线对板连接。

7. 封装信息： - 完全遮蔽 - 不可堆叠 - 不兼容表面贴装（SMC） - 工作温度范围：-55°C至+105°C - 通孔式电气连接 - 每个接触点最大电流：2.5A - 最大电压：250V - 无铅工艺能力：SMC和波峰焊能力（仅限通孔）

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