70567-0156

70567-0156

  • 厂商:

    MOLEX2

  • 封装:

  • 描述:

    70567-0156 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrou...

  • 详情介绍
  • 数据手册
  • 价格&库存
70567-0156 数据手册
This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015800445 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 44 Circuits, 0.76µm (30µ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating Documents: 3D Model Packaging Specification (PDF) Drawing (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Series Agency Certification CSA UL LR19980 E29179 General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits Detail Color - Resin First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part No 44 44 Black No 94V-0 No No None Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.40 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 30 0.75 75 1.875 Yes Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 70567Series Mates With 70450 Crimp Housing Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No Fully No No -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number 70567-0156 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
70567-0156
1. 物料型号: - 型号:0015800445 - 状态:Active(活跃) - 符合欧盟RoHS、中国RoHS、ELV和RoHS标准,REACH SVHC不含,无卤素,未审核。

2. 器件简介: - 描述:2.54mm(.100")间距C-Grid®插座,通孔无定位销,双排,垂直,带护罩,高温,44路,0.76µm(30µ")金(Au)选择性镀层,锡(Sn)PC尾镀层。

3. 引脚分配: - 电路(已加载):44路 - 颜色 - 树脂:黑色 - 行数:2 - 方向:垂直 - PCB厚度推荐:0.093英寸(2.40毫米) - 间距 - 接口:0.100英寸(2.54毫米)

4. 参数特性: - 阻燃等级:94V-0 - 镀层最小值:接口(µin)30,接口(µm)0.75,终止(µin)75,终止(µm)1.875 - 极化到配对部件:是

5. 功能详解: - 产品名称:C-Grid® - 物理特性:不可断裂 - 配对部件的键控:无 - 材料 - 金属:黄铜,钯青铜 - 材料 - 镀层:配对金 - 材料 - 树脂:高温热塑性塑料 - 材料 - 镀层终止:锡

6. 应用信息: - 产品家族:PCB插座 - 系列:70567 - 应用:线对板

7. 封装信息: - 封装类型:管装 - 引脚长度(英寸):0.130英寸 - 引脚长度(毫米):3.30毫米 - PCB定位:无 - PCB保持:是
70567-0156 价格&库存

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