70567-0169

70567-0169

  • 厂商:

    MOLEX2

  • 封装:

  • 描述:

    70567-0169 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrou...

  • 详情介绍
  • 数据手册
  • 价格&库存
70567-0169 数据手册
This document was generated on 05/26/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015800705 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.76µm (30µ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating Documents: 3D Model Drawing (PDF) Packaging Specification (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Series Agency Certification CSA UL LR19980 E29179 General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits Detail Color - Resin First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part No 70 70 Black No 94V-0 No No None Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.40 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 30 0.76 75 1.875 Yes Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 70567Series Mates With 70450 Crimp Housing Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No Fully No No -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number 70567-0169 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/26/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
70567-0169
1. 物料型号: - 型号:0015800705 - 状态:Active(活跃)

2. 器件简介: - 产品系列:70567系列 - 描述:2.54mm(.100")间距C-Grid®插座头,通孔无定位销,双排,垂直型。 - 环保合规性:符合欧盟RoHS、中国RoHS、ELV和RoHS指令,REACH SVHC不含SVHC,无卤素,未审核。

3. 引脚分配: - 电路数:70 - 引脚间距:2.54mm(.100") - 行数:2

4. 参数特性: - 颜色:黑色树脂 - 阻燃等级:94V-0 - 金属材质:黄铜,磷青铜 - 镀层:金镀层,锡PC尾镀层 - PCB厚度推荐:2.40mm - 引脚最小镀层厚度:0.76µm(30µ")金,1.875µm(75µ")锡

5. 功能详解: - 应用:线对板连接 - 极性:与插座部分极性匹配 - 工作温度范围:-55°C至+105°C - 最大电流每接触点:2.5A - 最大电压:250V - 焊接过程数据:最大过程温度下持续5秒,无铅焊接能力(仅限通孔)

6. 应用信息: - 与70450号压接式外壳配合使用

7. 封装信息: - 封装类型:通孔 - 封装材料:高温热塑性塑料 - 包装类型:管装
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