A-70567-0082

A-70567-0082

  • 厂商:

    MOLEX2

  • 封装:

  • 描述:

    A-70567-0082 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shr...

  • 详情介绍
  • 数据手册
  • 价格&库存
A-70567-0082 数据手册
This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015800323 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.38µm (15µ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating Documents: 3D Model Packaging Specification (PDF) Drawing (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Series Agency Certification CSA UL LR19980 E29179 General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits (maximum) Circuits Detail Color - Resin First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) No 32 32 32 Black No 94V-0 No No None Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.40 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 15 0.375 75 1.875 Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 70567Series Mates With 70450 Crimp Housing Polarized to Mating Part Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style Yes No Fully No No -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number A-70567-0082 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
A-70567-0082
1. 物料型号: - 型号:0015800323 - 状态:Active(活跃) - 符合欧盟RoHS、中国RoHS、ELV和RoHS标准,REACH SVHC不含SVHC,无卤素,未审核。

2. 器件简介: - 产品描述:2.54mm(.100")间距C-Grid头部,通孔无定位销,双屏蔽,高温,32路,0.38um(15")金(Au)选择性锡(Sn)PC尾镀层。

3. 引脚分配: - 电路(已加载):32路 - 最大电路数:32路 - 电路细节颜色-树脂:黑色。

4. 参数特性: - 产品系列:70567 - 应用:线对板(Wire-to-Board) - 物理特性:无断裂 - 材料-金属:黄铜,磷青铜 - 材料-电镀:金、锡 - 材料-树脂:高温热塑性塑料 - 行数:2行 - 垂直方向 - PCB厚度推荐:0.093英寸(2.40毫米) - 引脚间距:2.54mm(0.100英寸)

5. 功能详解: - 极化到配对部分:是 - 极化到PCB:否 - 全屏蔽 - 堆叠:否 - 表面贴装兼容(SMC):否 - 工作温度范围:-55°C至+105°C - 电气特性:每个接触点最大电流2.5A,最大电压250V

6. 应用信息: - 与70450压接式外壳配合使用。

7. 封装信息: - 包装类型:管装 - 引脚间距:2.54mm(0.100英寸)
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