A-70567-0159

A-70567-0159

  • 厂商:

    MOLEX2

  • 封装:

  • 描述:

    A-70567-0159 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shr...

  • 详情介绍
  • 数据手册
  • 价格&库存
A-70567-0159 数据手册
This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015800505 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76µm (30µ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating Documents: 3D Model Packaging Specification (PDF) Drawing (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Series Agency Certification UL E29179 General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits Detail Color - Resin First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB No 50 50 Black No 94V-0 No No None Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.40 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 30 0.75 75 1.875 Yes No Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 70567Series Mates With 70450 Crimp Housing Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style Fully No No -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number 70567-0159 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
A-70567-0159
1. 物料型号: - 型号:0015800505 - 描述:2.54mm (.100") 间距 C-Grid® 直插式双排垂直护罩型高温度50路0.76µm (30µ") 金(Au)选择性电镀锡(Sn)PC尾电镀。

2. 器件简介: - 产品名称:Physical Breakaway Circuits (Loaded) - 特点:垂直双排、护罩型、高温度、符合EU RoHS和中国RoHS标准,无卤素、无SVHC。

3. 引脚分配: - 引脚数量:50 - 引脚间距:2.54mm (0.100") 4. 参数特性: - 工作温度范围:-55°C至+105°C - 每接触最大电流:2.5A - 焊接过程数据:最大过程温度245°C,持续时间5秒,无铅焊接能力(仅限直插式)。

5. 功能详解: - 该连接器支持物理断开电路,具有阻燃特性,符合Glow-Wire测试标准。 - 提供3D模型、包装规格、产品规格和RoHS合规证书等文档。

6. 应用信息: - 适用于需要高温度和物理断开功能的电路连接,如电子设备内部连接。

7. 封装信息: - 封装类型:直插式 - 封装材料:黄铜、磷青铜,电镀材料包括金和锡。 - 封装颜色:黑色
A-70567-0159 价格&库存

很抱歉,暂时无法提供与“A-70567-0159”相匹配的价格&库存,您可以联系我们找货

免费人工找货