A-70567-0282

A-70567-0282

  • 厂商:

    MOLEX2

  • 封装:

  • 描述:

    A-70567-0282 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shr...

  • 详情介绍
  • 数据手册
  • 价格&库存
A-70567-0282 数据手册
This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015800249 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.38µm (15µ") Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm (.150") Inside Shroud to End Circuit Spacing Documents: 3D Model Drawing (PDF) Packaging Specification (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Series Agency Certification CSA UL LR19980 E29179 General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits (maximum) Circuits Detail Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) No 24 24 24 Black 25 No 94V-0 No No None Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.36 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 15 0.375 75 Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 70567Series Mates With 70013 Interim Clip Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 1.875 No No Open Ends No Yes -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V DC Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number A-70567-0282 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
A-70567-0282
1. 物料型号: - 型号:0015800249 - 状态:Active(活跃)

2. 器件简介: - 描述:2.54mm (.100") 间距 C-Grid® 直插式双排直立公头,无定位销。 - 环保合规:符合欧盟RoHS、中国RoHS、ELV和RoHS标准,REACH SVHC无含卤素,无卤素。

3. 引脚分配: - 引脚数量(已加载):24 - 最大引脚数量:24 - 引脚细节:24个引脚

4. 参数特性: - 耐热性:高温 - 电路数:24 - 镀层:金(Au)选择性镀锡(Sn)PC尾镀层 - 从内衬到端电路的距离:3.81mm (.150") 5. 功能详解: - 产品系列:70567 - 应用:线对板(Wire-to-Board) - 物理特性:无断裂 - 颜色 - 树脂:黑色 - 耐用性(最大插拔次数):25次 - 阻燃等级:94V-0 - 端子间距:2.54mm

6. 应用信息: - 配合70013型中间卡子使用

7. 封装信息: - 封装类型:Tube(管装) - 端子间距:2.54mm - 推荐PCB厚度:0.093英寸(2.36mm) - 引脚长度:0.130英寸(3.30mm) - 垂直方向:直立
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