A-70567-0283

A-70567-0283

  • 厂商:

    MOLEX2

  • 封装:

  • 描述:

    A-70567-0283 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shr...

  • 详情介绍
  • 数据手册
  • 价格&库存
A-70567-0283 数据手册
This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0015800269 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.38µm (15µ") Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm (.150") Inside Shroud to End Circuit Spacing Documents: 3D Model Drawing (PDF) Packaging Specification (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Series Agency Certification CSA UL LR19980 E29179 General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits (maximum) Circuits Detail Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) No 26 26 26 Black 25 No 94V-0 No No None Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm No Yes 0.093 In 2.36 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 15 0.375 75 Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 70567Series Mates With 70013 Interim Clip Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 1.875 No No Open Ends No Yes -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V DC Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number A-70567-0283 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
A-70567-0283
物料型号 - 型号:0015800269 - 状态:Active - 描述:cgrid sl products 2.54mm(.100) Pitch C-Grid Header, Through Hole without Peg, Dual Row Shrouded, High Temperature, 26 Circuits, 0.38um (15 ) Gold, (Au) Selective Tin (Sn) PC Tail Plating, 3.81mm (.150") Inside Shroud to End Circuit Spacing

器件简介 - 产品家族:PCB Headers - 系列:70567 - 应用:Wire-to-Board - 概述:cgrid_sl_products - 产品名称:C-GridR

引脚分配 - 引脚数量(已加载):26 - 最大引脚数量:26

参数特性 - 颜色 - 树脂:黑色 - 耐用性(最大插拔次数):25 - 首次配合/最后断开阻燃性:无 - 94V-0 - 符合Glow-Wire标准:否 - 导向配合部件:否 - 与配合部件的锁定:是 - 材料 - 金属:黄铜,锡磷青铜 - 材料 - 配合镀层:金 - 材料 - 终止镀层:锡 - 材料 - 树脂:高温热塑性塑料 - 行数:2 - 定向:垂直 - PCB尾长(英寸):0.130 In - PCB尾长(毫米):3.30 mm - PCB定位器:无 - PCB保持:是 - 推荐的PCB厚度(英寸):0.093 In - 推荐的PCB厚度(毫米):2.36 mm - 包装类型:管装 - 配合界面间距(英寸):0.100 In - 配合界面间距(毫米):2.54 mm - 终止界面间距(英寸):0.100 In - 终止界面间距(毫米):2.54 mm - 配合镀层最小值:15 uin - 配合镀层最小值(um):0.375 - 终止镀层最小值(uin):75 - 终止镀层最小值(um):1.875

功能详解 - 与70013型夹子配合使用 - 极化到配合部件:否 - 极化到PCB:否 - 带护罩:开端 - 可堆叠:否 - 兼容表面安装(SMC):是 - 操作温度范围:-55°C至+105°C - 终止界面:通孔 - 电气特性 - 每接触点最大电流:2.5A - 最大电压:250V DC - 焊接过程数据 - 最大过程温度下的持续时间(秒):5 - 无铅过程能力:SMC & 波峰焊(仅限TH) - 最大过程温度下的周期数:1 - 最大过程温度(°C):245

应用信息 - 该产品符合欧盟RoHS、中国RoHS、ELV和RoHS标准,REACH SVHC不含SVHC,无卤素状态。

封装信息 - 包装规格:PK-70873-0018 - 产品规格:PS-70567 - 销售图纸:SDA-70567-
A-70567-0283 价格&库存

很抱歉,暂时无法提供与“A-70567-0283”相匹配的价格&库存,您可以联系我们找货

免费人工找货