A-70634-0059

A-70634-0059

  • 厂商:

    MOLEX2

  • 封装:

  • 描述:

    A-70634-0059 - 2.54mm (.100) Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row,...

  • 详情介绍
  • 数据手册
  • 价格&库存
A-70634-0059 数据手册
This document was generated on 03/30/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0015912255 Active 2.54mm (.100") Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, .120" Pocket, Shrouded, with Press-fit Plastic Peg, 25 Circuits, 0.38µm (15µ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating Documents: 3D Model Packaging Specification (PDF) Drawing (PDF) Product Specification PS-70400 (PDF) Product Specification PS-70541 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL LR19980 E29179 General Product Family Series Application Product Name PCB Headers 70634 Wire-to-Board SL™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Shrouded Stackable Temperature Range - Operating Termination Interface: Style No 25 25 Black 50 94V-0 No Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 1 Right Angle Yes Yes 0.062 In 1.60 mm Tube 0.100 In 2.54 mm 15 0.375 75 1.875 Yes Yes Fully No -40°C to +105°C Surface Mount Search Parts in this Series 70634Series Mates With 70066n , 70066g , 70430g , 70400g Housing Electrical Current - Maximum per Contact 3A Voltage - Maximum 250V Solder Process Data Lead-free Process Capability Process Temperature max. C Reflow Capable (SMT only) 260 Material Info Old Part Number 70634-0059 Reference - Drawing Numbers Product Specification Sales Drawing PS-70400, PS-70541 SDA-70634-**** This document was generated on 03/30/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
A-70634-0059
1. 物料型号: - 型号:0015912255 - 状态:Active(活跃)

2. 器件简介: - 描述:2.54mm(.100") 间距 SLTM 线对板头,低轮廓,表面贴装,排,直角,.120" 口袋,带护套,配有压配合塑料钉,25 路 0.38um (15") 金 (Au) 选择性电镀锡 (Sn) PC 尾电镀。

3. 引脚分配: - 电路(已加载):25 - 电路(最大):25

4. 参数特性: - 颜色 - 树脂:黑色 - 耐用性(最大插拔次数):50 - 阻燃等级:94V-0 - 锁扣到配对部件:是 - 金属材质:黄铜,锡磷青铜 - 电镀材质 - 配对:金 - 电镀材质 - 终止:锡 - 树脂材质:高温热塑性塑料 - 行数:1 - 接口方向:直角 - PCB定位:是 - PCB保持:是 - 推荐PCB厚度(英寸):0.062 In - 推荐PCB厚度(毫米):1.60 mm - 包装类型:管装 - 配对接口间距(英寸):0.100 In - 配对接口间距(毫米):2.54 mm - 电镀最小:配对(uin):15 - 电镀最小:配对(um):0.375 - 电镀最小:终止(uin):75 - 电镀最小:终止(um):1.875 - 极化到配对部件:是 - 极化到PCB:是 - 护套:全护套 - 可堆叠:否 - 工作温度范围:-40°C 至 +105°C - 终止接口:表面贴装

5. 功能详解: - 电流 - 每个接触点最大:3A

6. 应用信息: - 产品家族:PCB头 - 系列:70634 - 应用:线对板

7. 封装信息: - 封装类型:表面贴装
A-70634-0059 价格&库存

很抱歉,暂时无法提供与“A-70634-0059”相匹配的价格&库存,您可以联系我们找货

免费人工找货