A-70634-0077

A-70634-0077

  • 厂商:

    MOLEX2

  • 封装:

  • 描述:

    A-70634-0077 - 2.54mm (.100) Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row,...

  • 详情介绍
  • 数据手册
  • 价格&库存
A-70634-0077 数据手册
This document was generated on 04/08/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0015913083 Active 2.54mm (.100") Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, .120" Pocket, Shrouded, with Press-fit Plastic Peg, 8 Circuits, 0.76µm (30µ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating Documents: 3D Model Packaging Specification (PDF) Drawing (PDF) Product Specification PS-70400 (PDF) Product Specification PS-70541 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL LR19980 E29179 General Product Family Series Application Product Name PCB Headers 70634 Wire-to-Board SL™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Shrouded Stackable Temperature Range - Operating Termination Interface: Style No 8 8 Black 50 94V-0 No Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 1 Right Angle Yes Yes 0.062 In 1.60 mm Tube 0.100 In 2.54 mm 30 0.75 75 1.875 Yes Yes Fully No -40°C to +105°C Surface Mount Search Parts in this Series 70634Series Mates With 70066n , 70066g , 70430g , 70400g Housing Electrical Current - Maximum per Contact 3A Voltage - Maximum 250V Solder Process Data Lead-free Process Capability Process Temperature max. C Reflow Capable (SMT only) 260 Material Info Old Part Number 70634-0077 Reference - Drawing Numbers Product Specification Sales Drawing PS-70400, PS-70541 SDA-70634-**** This document was generated on 04/08/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
A-70634-0077
1. 物料型号: - 型号:0015913083 - 状态:Active(活跃)

2. 器件简介: - 描述:2.54mm (.100) 间距 SLTM 线对板头,低轮廓,表面贴装排列,直角型,.120" 口袋,带护套,配有压入式塑料钉,8路 0.76um (30 ) 金 (Au) 选择性电镀,锡 (Sn) PC尾电镀。

3. 引脚分配: - 电路数(最大):8 - 引脚排列:1排

4. 参数特性: - 断路器电路(已加载):无 - 颜色 - 树脂:黑色 - 耐用性(最大插拔次数):50次 - 阻燃性:94V-0 - 符合防火测试:否 - 锁到配对部件:是 - 金属材质:黄铜,磷青铜 - 电镀材质:金 - 电镀终止材质:锡 - 树脂材质:高温热塑性塑料 - 行数:1 - 朝向:直角 - PCB定位/PCB保持:是 - PCB厚度推荐(英寸):0.062 In - PCB厚度推荐(毫米):1.60 mm - 包装类型:管装 - 配对接口间距(英寸):0.100 In - 配对接口间距(毫米):2.54 mm - 电镀最小:配对(uin):30 - 电镀最小:配对(um):0.75 - 电镀最小:终止(uin):75 - 电镀最小:终止(um):1.875 - 极化到配对部件:是 - 极化到PCB:是 - 护套:完全 - 可堆叠:否 - 工作温度范围:-40°C至+105°C

5. 功能详解: - 电气特性:每个接触点最大电流3A,最大电压250V,无铅工艺能力,回流能力(仅限SMT)260°C。

6. 应用信息: - 产品家族:PCB头 - 系列:70634 - 应用:线对板 - 产品名称:SLTM

7. 封装信息: - 封装类型:表面贴装 - 引脚间距:2.54mm
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