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0039299169

0039299169

  • 厂商:

    MOLEX3

  • 封装:

  • 描述:

    0039299169 - 4.20mm (.165") Pitch Mini-Fit Jr.â„¢ Header, Dual Row, Vertical, with Snap-in Plastic P...

  • 详情介绍
  • 数据手册
  • 价格&库存
0039299169 数据手册
This document was generated on 05/21/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0039299169 Active minifit_jr 4.20mm (.165") Pitch Mini-Fit Jr.™ Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 16 Circuits, PA Polyamide Nylon 6/6 94V-0, 0.76µm (30µ") Gold (Au) Selective Plating, without Drain Holes Documents: 3D Model Drawing (PDF) Product Specification PS-5556-001 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series Agency Certification CSA TUV UL LR19980 R72081037 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Comments PCB Headers 5566 Wire-to-Board Current = 13A max. per circuit when header is mated to a receptacle loaded with 45750 Mini-Fit Plus HCS™ Crimp Terminal Crimpted to to 16 AWG wire. . See Molex product specification PS-45750-001 for additional current de-rating information.. High Temperature, Square Pin, Solder Type minifit_jr Mini-Fit Jr.™ Overview Product Name Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) No 16 16 Natural 30 No 94V-0 No No None Yes Brass Gold Tin Nylon 2 Vertical 0.138 In 3.50 mm Yes Yes 0.062 In 1.60 mm Tray 0.165 In 4.20 mm Search Parts in this Series 5566Series Mates With 5557 Mini-Fit Jr.™ Receptacle Housing Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 0.165 In 4.20 mm 30 0.76 100 2.50 Yes Yes Fully No No -40°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 13A 600V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 Wave Capable (TH only) 1 240 Material Info Old Part Number 5566-16A2GS-210 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing Test Summary PK-5566-001 PS-5556-001 SDA-5566-N*2*-* TS-5556-002 This document was generated on 05/21/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0039299169
1. 物料型号: - 型号:0039299169 - 状态:Active(活跃)

2. 器件简介: - 描述:Selective Plating, without Drain Holes(选择性镀层,无排水孔) - 类型:4.20mm (.165") Pitch Mini-Fit Jr.™ Header, Dual Row, Vertical, With Snap-in Plastic Peg PCB Lock, 16 Circuits, PA Polyamide Nylon 6/6 94V-0, 0.76um (30") Gold (Au)(4.20mm (.165") 间距 Mini-Fit Jr.™ 双排直插式,带卡扣塑料卡PCB锁,16路,PA聚酰胺尼龙6/6 94V-0,0.76um (30") 金 (Au))

3. 引脚分配: - 电路(已加载):16 - 电路(最大):16 - 引脚排列:双排,垂直

4. 参数特性: - 电流 - 每个接触点最大:13A - 电压 - 最大:600V - 焊接过程数据:在最大过程温度下持续时间为5秒,无铅工艺能力(TH only),最大周期数为1,最大过程温度为240°C

5. 功能详解: - 产品系列:5566 - 应用:Wire-to-Board(线对板) - 注释:当插座与45750 Mini-Fit Plus HCS压接端子配合使用,压接到16 AWG线上时,每个电路最大电流为13A。更多电流降额信息请参考Molex产品规范PS-45750-001。

6. 应用信息: - 产品家族:PCB Headers - 系列:5566 - 应用:Wire-to-Board

7. 封装信息: - 封装类型:Tray(托盘) - 引脚间距 - 配合接口(in):0.165 In - 引脚间距 - 配合接口(mm):4.20 mm - 配合接口镀层最小厚度(uin):30 - 配合接口镀层最小厚度(um):0.76 - 终止接口镀层最小厚度(uin):100 - 终止接口镀层最小厚度(um):2.50
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