SD-30700-520

厂商：
MOLEX4
封装：
描述：
SD-30700-520 - 2.54mm (.100") Pitch, 0.64mm (.025") Width H-DAC 64™ - Molex Electronics Ltd.

数据手册：

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数据手册
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SD-30700-520 数据手册

This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0307005167 Active hdac_64_dualrow_high_density_automotive_connectors 2.54mm (.100") Pitch, 0.64mm (.025") Width H-DAC 64™ High Density Automotive Header, Dual Row, Right Angle 16 Circuits Documents: Application Specification (PDF) Drawing (PDF) Product Specification PS-30700-0001 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only PCB Headers 30700 Board-to-Board Polarization Option 1 hdac_64_dualrow_high_density_automotive_connectors H-DAC 64™ EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Comments Overview Product Name Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Polarized to Mating Part Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No 16 16 Gray 25 No No No None Yes Brass Tin Tin Modified Polystyrene 2 Right Angle 0.145 In 3.69 mm Yes Yes 0.061 In 1.57 mm Tray 0.100 In 2.54 mm Yes Yes Fully No No -40°C to +105°C Through Hole Search Parts in this Series 30700Series Mates With 307001 H-DAC 64™ High Density Crimp Housing Electrical Current - Maximum per Contact Voltage - Maximum 7A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 40 SMC & Wave Capable (TH only) 3 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-30907-260 PS-30700-0001 SD-30700-520 This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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SD-30700-520

1. 物料型号： - 型号：0307005167 - 状态：Active（活跃）

2. 器件简介： - 产品系列：30700 - 应用：板对板（Board-to-Board） - 描述：2.54mm（.100"）间距，0.64mm（.025"）宽H-DAC 64™高密度汽车头，双排，直角16路

3. 引脚分配： - 电路（已加载）：16路 - 行数：2 - 极化到PCB：是

4. 参数特性： - 耐温性能：-40°C至+105°C - 电气特性：最大电流每接触点7A，最大电压250V - 机械特性：耐用性（最大插拔次数）25次

5. 功能详解： - 产品名称：H-DAC 64™ - 物理特性：直角，无断开，有锁扣，完全遮蔽，PCB定位器，PCB保持，推荐PCB厚度1.57mm - 电气特性：最大电流每接触点7A，最大电压250V

6. 应用信息： - 应用：板对板连接 - 极化选项：1 - 符合欧盟RoHS、中国RoHS、ELV和RoHS，不含SVHC，无卤素

7. 封装信息： - 封装类型：Tray（托盘） - 插接界面间距：2.54mm - 引脚风格：通孔（Through Hole）

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