0436500311

0436500311

  • 厂商:

    MOLEX5

  • 封装:

  • 描述:

    0436500311 - 3.00mm (.118") Pitch Micro-Fit 3.0â„¢ Header, Surface Mount Compatible, Single Row, Rig...

  • 详情介绍
  • 数据手册
  • 价格&库存
0436500311 数据手册
This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0436500311 Active microfit_30 3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Single Row, Right Angle, with PCB Press-fit Metal Retention Clip, 3 Circuits, 0.76µm (30µ") Gold (Au) Selective Plating, Glow Wire Compatible Documents: 3D Model Drawing (PDF) Product Specification PS-43650 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series Agency Certification CSA TUV UL LR19980 R72081037 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Comments Overview Product Literature Order No Product Name PCB Headers 43650 Wire-to-Board High Temperature|Square Pin|Solder Type microfit_30 USA-106 Micro-Fit 3.0™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Mated Height (in) Mated Height (mm) Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Shrouded Stackable Temperature Range - Operating No 3 3 Black 30 94V-0 Yes 0.275 In 6.98 mm Brass Gold Tin High Temperature Thermoplastic 1 Right Angle Yes Yes 0.062 In 1.60 mm Embossed Tape on Reel 0.118 In 3.00 mm 30 0.76 100 2.50 Yes Fully No -40°C to +105°C Search Parts in this Series 43650Series Mates With 43645 Micro-Fit 3.0™ Receptacle Housing Termination Interface: Style Surface Mount Electrical Current - Maximum per Contact Voltage - Maximum 5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 30 Reflow Capable (SMT only) 3 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing Test Summary PK-70873-07** PS-43650 SD-43650-004 TS-43045-002 This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0436500311
物料型号: - 型号:0436500311

器件简介: - 描述:3.00mm (.118") 间距Micro-Fit 3.0™ 公头,兼容表面贴装,直角设计,带有PCB压接金属保持夹,3路,0.76um (30 (Au) 选择性镀金,灼热丝兼容。

引脚分配: - 电路(已安装):3 - 电路(最大):3

参数特性: - 颜色 - 树脂:黑色 - 耐久性(最大插配次数):30 - 阻燃性:94V-0 - 灼热丝兼容:是 - 配合高度(英寸):0.275英寸 - 配合高度(毫米)材料 - 金属:黄铜 - 材料 - 镀层配合:金 - 材料 - 镀层终止:锡 - 材料 - 树脂:耐高温热塑性塑料 - 行数:1 - 方向:直角 - PCB定位:是 - PCB保持:是 - 推荐PCB厚度(英寸):0.062英寸 - 推荐PCB厚度(毫米):1.60毫米 - 包装类型:卷带浮雕胶带 - 配合界面间距(英寸):0.118英寸 - 配合界面间距(毫米):3.00毫米 - 镀层最小:配合(英寸):30 - 镀层最小:配合(微米):0.76 - 镀层最小:终止(微米):100 - 镀层最小:终止(微米):2.50 - 极化到PCB:是 - 护套:全护套 - 可堆叠:否 - 工作温度范围:-40°C至+105°C

功能详解: - 产品系列:PCB头 - 产品名称:Micro-Fit 3.0™ - 产品文献订单号:USA-106 - 产品家族:43650系列 - 应用:线对板

应用信息: - 适用于线对板连接,高耐温,方头焊接类型。

封装信息: - 封装类型:浮雕胶带卷带
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