0436500319

厂商：
MOLEX5
封装：
描述：
0436500319 - 3.00mm (.118") Pitch Micro-Fit 3.0â„¢ Header, Surface Mount Compatible, Single Row, Ver...

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0436500319 数据手册

This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0436500319 Active microfit_30 3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Single Row, Vertical, with Press-fit Metal Retention Clip, 3 Circuits, 0.38µm (15µ") Gold (Au) Selective Plating, Glow Wire Compatible Documents: 3D Model Drawing (PDF) Packaging Specification (PDF) Product Specification PS-43650 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA TUV UL LR19980 R72081037 E29179 General Product Family Series Application Comments Overview Product Literature Order No Product Name PCB Headers 43650 Wire-to-Board High Temperature|Square Pin|Offset Through Hole Mounting|Solder Type microfit_30 USA-106 Micro-Fit 3.0™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Mated Height (in) Mated Height (mm) Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Shrouded No 3 3 Black 30 94V-0 Yes 0.680 In 17.27 mm Brass Gold Tin High Temperature Thermoplastic 1 Vertical Yes Yes 0.062 In 1.60 mm Tray 0.118 In 3.00 mm 15.2 0.38 100 2.5 Yes Fully Search Parts in this Series 43650Series Mates With 43645 Micro-Fit 3.0™ Receptacle Housing Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No Yes -40°C to +105°C Through Hole - Kinked Pin Electrical Current - Maximum per Contact Voltage - Maximum 5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 30 SMC & Wave Capable (TH only) 3 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing Test Summary PK-70873-0811 PS-43650 SD-43650-007 TS-43045-002 This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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0436500319

1. 物料型号： - 型号：0436500319 - 状态：Active - 描述：microfit_30 Selective Plating, Glow Wire Compatible, 3.00mm (.118") Pitch Micro-Fit 3.0TM Header, Surface Mount Compatible, Single Row, Vertical, with Press-fit Metal Retention Clip, 3 Circuits, 0.38um (15") Gold (Au)

2. 器件简介： - 产品系列：43650 - 应用：Wire-to-Board - 特点：High Temperature, Square Pin, Offset Through Hole - 产品名称：Micro-Fit 3.0TM - 物理特性：无断裂，3路电路，最大33路电路，黑色树脂，耐用性30次，94V-0阻燃等级，通过Glow-Wire测试。

3. 引脚分配： - 引脚数量：1排，垂直方向，间距为3.00mm（0.118"）。

4. 参数特性： - 金属材质：黄铜 - 镀层：接触部位镀金，终止部位镀锡 - 耐温塑料：高温热塑性塑料 - PCB厚度推荐：0.062"（1.60mm）

5. 功能详解： - 该连接器为Wire-to-Board应用，具有高耐温特性和方形引脚设计，偏置通孔安装方式。 - 具有压配合金属保持夹，用于确保与PCB的稳定连接。

6. 应用信息： - 适用于需要高耐温和高可靠性连接的应用场合，如汽车电子、工业控制等。

7. 封装信息： - 封装类型：Tray - 引脚间距：3.00mm（0.118"） - PCB定位：是 - PCB保持：是 - 极化到PCB：是 - 全封闭：完全封闭

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