43045-2025

43045-2025

  • 厂商:

    MOLEX5

  • 封装:

  • 描述:

    43045-2025 - 3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Dual Row, Vertica...

  • 详情介绍
  • 数据手册
  • 价格&库存
43045-2025 数据手册
This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0430452025 Active microfit_30 3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Dual Row, Vertical, with Press-fit Metal Retention Clip, 20 Circuits, 0.38µm (15µ") Gold (Au) Selective Plating, Glow Wire Compatible Documents: 3D Model Drawing (PDF) Product Specification PS-43045 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series Agency Certification CSA TUV UL LR19980 R72081037 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Comments Overview Product Literature Order No Product Name PCB Headers 43045 Wire-to-Board High Temperature|Square Pin|Offset Through Hole Mounting|Solder Type microfit_30 USA-106 Micro-Fit 3.0™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Mated Height (in) Mated Height (mm) Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Shrouded Stackable No 20 20 Black 30 94V-0 Yes 0.680 In 17.27 mm Brass Gold Tin High Temperature Thermoplastic 2 Vertical Yes Yes 0.062 In 1.60 mm Tray 0.118 In 3.00 mm 15 0.38 100 2.50 Yes Fully No Search Parts in this Series 43045Series Mates With 43025 Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style Yes -40°C to +105°C Through Hole - Kinked Pin Electrical Current - Maximum per Contact Voltage - Maximum 5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 30 SMC & Wave Capable (TH only) 3 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing Test Summary PK-70873-0314 PS-43045, RPS-43045-003, RPS-43045-004 SD-43045-009 TS-43045-001, TS-43045-002 This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
43045-2025
1. 物料型号: - 型号:0430452025 - 状态:Active(活跃)

2. 器件简介: - 描述:3.00mm (.118) 间距 Micro-Fit 3.0™ 双排直立式连接器,兼容表面贴装,带压接金属保持夹,20路,0.38m (15") 金(Au)选择性镀层,灼热丝兼容。

3. 引脚分配: - 引脚数量:20路(满载)

4. 参数特性: - 颜色 - 树脂:黑色 - 耐久性(最大插拔次数):30次 - 阻燃性:94V-0 - 灼热丝合规性:是 - 配合高度(英寸):0.680英寸 - 配合高度(毫米):17.27毫米 - 金属材质:黄铜 - 镀层 - 配合:金 - 镀层 - 终止:锡 - 树脂材质:耐高温热塑性塑料 - 排数:2 - 方向:垂直 - PCB定位:是 - PCB保持:是 - 推荐PCB厚度(英寸):0.062英寸 - 推荐PCB厚度(毫米):1.60毫米 - 包装类型:托盘 - 配合界面间距(英寸):0.118英寸 - 配合界面间距(毫米):3.00毫米 - 镀层最小厚度 - 配合(微英寸):15 - 镀层最小厚度 - 配合(微米):0.38 - 镀层最小厚度 - 终止(微英寸):100 - 镀层最小厚度 - 终止(微米):2.50 - 极化到PCB:是 - 护套:全护套 - 可堆叠:否

5. 功能详解: - 该连接器为Wire-to-Board应用,具有高温、方头、偏置通孔安装、焊料类型的特点。

6. 应用信息: - 应用:线对板连接

7. 封装信息: - 封装类型:表面贴装兼容(SMC) - 工作温度范围:-40°C至+105°C - 电气电流 - 每个接触点最大:5A - 电压 - 最大:250V - 焊接过程数据:适用于无铅焊接过程,最大周期数260次
43045-2025 价格&库存

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