43650-0321

43650-0321

  • 厂商:

    MOLEX5

  • 封装:

  • 描述:

    43650-0321 - 3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Single Row, Verti...

  • 详情介绍
  • 数据手册
  • 价格&库存
43650-0321 数据手册
This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0436500321 Active microfit_30 3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Single Row, Vertical, with Press-fit Metal Retention Clip, 3 Circuits, Tin (Sn) Plating, Glow Wire Compatible Documents: 3D Model Drawing (PDF) Product Specification PS-43650 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA TUV UL LR19980 R72081037 E29179 General Product Family Series Application Comments Overview Product Literature Order No Product Name PCB Headers 43650 Wire-to-Board High Temperature|Square Pin|Solder Type microfit_30 USA-106 Micro-Fit 3.0™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Mated Height (in) Mated Height (mm) Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Shrouded Stackable Temperature Range - Operating No 3 3 Black 30 94V-0 Yes 0.680 In 17.27 mm Brass Tin Tin High Temperature Thermoplastic 1 Vertical Yes Yes 0.062 In 1.60 mm Embossed Tape on Reel 0.118 In 3.00 mm 100, 35 0.88, 2.5 100, 35 0.88, 2.5 Yes Fully No -40°C to +105°C Search Parts in this Series 43650Series Mates With 43645 Micro-Fit 3.0™ Receptacle Housing Termination Interface: Style Surface Mount Electrical Current - Maximum per Contact Voltage - Maximum 5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 30 Reflow Capable (SMT only) 3 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-07** PS-43650 SD-43650-008 This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
43650-0321
1. 物料型号: - 型号:0436500321 - 状态:Active(激活状态) - 描述:3.00mm (.118") 间距Micro-Fit™ 3.0TM 直插式头,表面贴装兼容,带压配合金属保持夹,3路,锡(Sn)镀层,发光。

2. 器件简介: - 产品系列:Micro-Fit 3.0™ - 产品名称:Micro-Fit 3.0™ - 应用:线对板(Wire-to-Board) - 特点:高温、方型引脚、焊接类型

3. 引脚分配: - 电路(已加载):3 - 电路(最大):3

4. 参数特性: - 颜色 - 树脂:黑色 - 耐久性(最大插拔次数):30 - 阻燃性:94V-0 - 发光线合规性:是 - 配合高度(英寸):0.680 In - 配合高度(毫米):17.27mm - 材料 - 金属:黄铜 - 材料 - 镀层配合:锡 - 材料 - 镀层终止:锡 - 材料 - 树脂:高温热塑性塑料 - 排数:1 - 方向:垂直 - PCB定位:是 - PCB保持:是 - PCB厚度推荐(英寸):0.062 In - PCB厚度推荐(毫米):1.60 mm - 间距 - 配合界面(英寸):0.118 In - 间距 - 配合界面(毫米):3.00 mm - 镀层最小:配合(微英寸):100,35 - 镀层最小:配合(微米):0.88, 2.5 - 镀层最小:终止(微英寸):100,35 - 镀层最小:终止(微米):0.88, 2.5 - 极化到PCB:是 - 遮蔽:全遮蔽 - 可堆叠:否 - 工作温度范围:-40°C至+105°C

5. 功能详解: - 该连接器为Micro-Fit 3.0™系列,适用于线对板连接,具有高温性能和方型引脚设计,适用于焊接类型连接。

6. 应用信息: - 适用于高温环境,方型引脚设计,焊接类型连接。
43650-0321 价格&库存

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