43650-0327

43650-0327

  • 厂商:

    MOLEX5

  • 封装:

  • 描述:

    43650-0327 - 3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Single Row, Verti...

  • 详情介绍
  • 数据手册
  • 价格&库存
43650-0327 数据手册
This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0436500327 Active microfit_30 3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Single Row, Vertical, with PCB Polarizing Peg, 3 Circuits, Tin (Sn) Plating, Glow Wire Compatible Documents: 3D Model Drawing (PDF) Packaging Specification (PDF) Product Specification PS-43650 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only Agency Certification CSA TUV UL LR19980 R72081037 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Comments Overview Product Literature Order No Product Name PCB Headers 43650 Wire-to-Board High Temperature|Square Pin|Solder Type microfit_30 USA-106 Micro-Fit 3.0™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Lock to Mating Part Mated Height (in) Mated Height (mm) Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB No 3 3 Black 30 94V-0 Yes Yes 0.680 In 17.27 mm Brass Tin Tin High Temperature Thermoplastic 1 Vertical 0.125 In 3.18 mm Yes None 0.062 In 1.60 mm Tray 0.118 In 3.00 mm 100 2.5 100 2.5 Yes Search Parts in this Series 43650Series Mates With 43645 Micro-Fit 3.0™ Receptacle Housing Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style Fully No Yes -40°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 30 SMC & Wave Capable (TH only) 3 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0811 PS-43650 SD-43650-010 This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
43650-0327
1. 物料型号: - 型号:0436500327

2. 器件简介: - 描述:Active microfit_30,垂直安装,带PCB极化销,3路电路,锡(Sn)镀层,通过Cd的辉光线测试。 - 产品名称:Micro-Fit 3.0™ - 产品系列:43650 Wire-to-Board,适用于高温、方形引脚、焊接类型。

3. 引脚分配: - 电路(已加载):3 - 最大电路数:3

4. 参数特性: - 颜色 - 树脂耐用性(最大插拔次数):黑色,30次 - 阻燃等级:94V-0,符合 - 锁扣到配合部件:是 - 配合高度:0.680英寸/17.27毫米 - 材料 - 金属:黄铜 - 材料 - 镀层 - 配合:锡 - 材料 - 镀层 - 终止:锡 - 材料 - 树脂:高温热塑性塑料 - 排数:1 - 取向:垂直 - PCB尾长:0.125英寸/3.18毫米 - PCB定位器:是 - PCB保持力:无 - 推荐PCB厚度:0.062英寸/1.60毫米 - 配合界面间距:0.118英寸/3.00毫米 - 镀层最小 - 配合:100微英寸/2.5微米 - 镀层最小 - 终止:100微英寸/2.5微米 - 极化到PCB:是

5. 功能详解: - 该连接器与43645 Micro-Fit 3.0™插座外壳兼容,支持遮蔽堆叠、可堆叠表面安装。 - 操作温度范围:-40°C至+105°C。 - 可通过通孔焊接,最大电流5A,最大电压250V。

6. 应用信息: - 适用于高温环境,方形引脚设计,焊接类型。

7. 封装信息: - 包装类型:托盘包装。 - 引脚间距:3.00毫米。 - 镀层:最小2.5微米。
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