43650-0422

厂商：
MOLEX5
封装：
描述：
43650-0422 - 3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Single Row, Verti...

数据手册：

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43650-0422 数据手册

This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0436500422 Active microfit_30 3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Single Row, Vertical, with Press-fit Metal Retention Clip, 4 Circuits, 0.38µm (15µ") Gold (Au) Selective Plating, Glow Wire Compatible Documents: 3D Model Drawing (PDF) Product Specification PS-43650 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA TUV UL LR19980 R72081037 E29179 General Product Family Series Application Comments Overview Product Literature Order No Product Name PCB Headers 43650 Wire-to-Board Glow Wire Equivalent Part Number 436500422. High Temperature, Square Pin, Solder Type microfit_30 USA-106 Micro-Fit 3.0™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Mated Height (in) Mated Height (mm) Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Shrouded Stackable No 4 4 Black 30 94V-0 Yes 0.680 In 17.27 mm Brass Gold, Tin Tin High Temperature Thermoplastic 1 Vertical Yes Yes 0.062 In 1.60 mm Embossed Tape on Reel 0.118 In 3.00 mm 15.2, 35 0.38, 0.88 100, 35 0.88, 2.5 Yes Fully No Search Parts in this Series 43650Series Mates With 43645 Micro-Fit 3.0™ Receptacle Housing Temperature Range - Operating Termination Interface: Style -40°C to +105°C Surface Mount Electrical Current - Maximum per Contact Voltage - Maximum 5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 30 Reflow Capable (SMT only) 3 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing Test Summary PK-70873-07** PS-43650 SD-43650-008 TS-43045-002 This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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43650-0422

1. 物料型号： - 型号：0436500422 - 状态：Active（活跃）

2. 器件简介： - 描述：3.00mm (.118") 间距 Micro-Fit 3.0™ 公头，兼容表面贴装，单排，垂直，带压接金属保持夹，4路，0.38µm (15µ") 金 (Au) 选择性镀层，通过灼热丝测试。 - 产品家族：PCB 公头 - 系列：43650 - 应用：线对板（Wire-to-Board）

3. 引脚分配： - 已载电路数：4 - 最大电路数：4

4. 参数特性： - 颜色 - 树脂：黑色 - 耐久性（插拔周期最大）：30 - 阻燃性：94V-0 - 通过灼热丝测试：是 - 配合高度（英寸）：0.680 In - 配合高度（毫米）：17.27 mm - 材料 - 金属：黄铜 - 材料 - 镀层：镀金、镀锡 - 材料 - 镀层终止：镀锡 - 材料 - 树脂：耐高温热塑性塑料 - 行数：1 - 方向：垂直 - PCB定位：是 - PCB保持：是 - 推荐PCB厚度（英寸）：0.062 In - 推荐PCB厚度（毫米）：1.60 mm - 包装类型：卷带压花 - 配合界面间距（英寸）：0.118 In - 配合界面间距（毫米）：3.00 mm - 镀层最小：配合（微英寸）：15.2, 35 - 镀层最小：配合（微米）：0.38, 0.88 - 镀层最小：终止（微英寸）：100, 35 - 镀层最小：终止（微米）：0.88, 2.5 - 极化到PCB：是 - 全覆盖：是 - 可堆叠：否

5. 功能详解： - 与43645 Micro-Fit 3.0™ 母头外壳配合使用。

6. 应用信息： - 工作温度范围：-40°C至+105°C - 表面贴装 - 电气：每个接触点最大电流5A，最大电压250V - 焊接过程数据：无铅回流能力（仅限SMT），最大周期次数，最高处理温度260°C，持续时间30秒。

7. 封装信息： - 封装类型：SMT/CLIPS/TRAYSOLE - 参考 - 绘图编号：PK-70873-07, PS-43650, SD-43650-008, TS-43045-002

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