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0436500905

0436500905

  • 厂商:

    MOLEX6

  • 封装:

  • 描述:

    0436500905 - 3.00mm (.118") Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Right ...

  • 详情介绍
  • 数据手册
  • 价格&库存
0436500905 数据手册
This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0436500905 Active microfit_30 3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Single Row, Right Angle, with Press-fit Metal Retention Clip, 9 Circuits, 0.76µm (30µ") Gold (Au) Selective Plating, Glow Wire Compatible Documents: 3D Model Drawing (PDF) Packaging Specification (PDF) Product Specification PS-43650 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series Agency Certification CSA TUV UL LR19980 R72081037 E29179 General Product Family Series Application Comments Overview Product Literature Order No Product Name PCB Headers 43650 Wire-to-Board High Temperature|Square Pin|Solder Type microfit_30 USA-106 Micro-Fit 3.0™ EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Mated Height (in) Mated Height (mm) Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Shrouded Stackable No 9 9 Black 30 94V-0 Yes 0.275 In 6.98 mm Brass Gold Tin High Temperature Thermoplastic 1 Right Angle Yes Yes 0.062 In 1.60 mm Tray 0.118 In 3.00 mm 30 0.76 100 2.50 Yes Fully No Search Parts in this Series 43650Series Mates With 43645 Micro-Fit 3.0™ Receptacle Housing Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style Yes -40°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 30 SMC & Wave Capable (TH only) 3 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing Test Summary PK-70873-0321 PS-43650 SD-43650-002 TS-43045-002 This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0436500905
1. 物料型号: - 型号:0436500905 - 描述:Active microfit 30 Selective Plating, Glow Wire Compatible

2. 器件简介: - 产品名称:Micro-Fit 3.0™ - 概述:3.00mm (.118") 间距 Micro-Fit 3.0™ 公头,兼容表面贴装,单排右角,带压接金属保持夹,9路,0.76um (30") 金 (Au) 镀层。

3. 引脚分配: - 电路(已加载)/最大电路数:9/9

4. 参数特性: - 颜色 - 树脂耐用性(最大插拔次数):黑色/30次 - 阻燃性:94V-0 - 符合灼热丝测试:是 - 配合高度(英寸):0.275 - 配合高度(毫米):6.98 mm - 金属材质:黄铜 - 镀层材质 - 配合:金 - 镀层材质 - 终止:锡 - 树脂材质:高温热塑性塑料 - 行数:1 - 方向:直角 - PCB定位/PCB保持:是/是 - 推荐PCB厚度(英寸):0.062 In - 推荐PCB厚度(毫米):1.60 mm - 包装类型:托盘 - 配合接口间距(英寸):0.118 In - 配合接口间距(毫米):3.00 mm - 镀层最小:配合(uin):30 - 镀层最小:配合(um):0.76 - 镀层最小:终止(uin):100 - 镀层最小:终止(um):2.50 - 极化到PCB:是 - 带护套:完全 - 可堆叠:否

5. 功能详解: - 与43645 Micro-Fit 3.0™ 插座外壳配合使用 - 表面贴装兼容(SMC):是 - 工作温度范围:-40°C至+105°C - 终止界面:通孔式 - 每接触最大电流:5A - 最大电压:250V - 最大过程温度下持续时间(秒):焊接过程数据30秒 - 无铅工艺能力:最大C过程温度260

6. 应用信息: - 产品家族:PCB公头 - 系列:43650 - 应用:线对板 - 注释:高温方形引脚焊接类型

7. 封装信息: - 封装类型:托盘 - 引脚间距:3.00mm
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