0444281605

厂商：
MOLEX6
封装：
描述：
0444281605 - 3.00mm (.118") Pitch Micro-Fit 3.0 BMIâ„¢ Header, Surface Mount Compatible, DualRow, Ri...

数据手册：

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0444281605 数据手册

This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0444281605 Active microfit_30 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Right Angle, without Snap-in Plastic Peg PCB Lock, 16 Circuits, 0.38µm (15µ") Gold (Au) Selective Plating Documents: 3D Model Drawing (PDF) Product Specification PS-44300-001 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series Agency Certification CSA TUV UL LR19980 R72081037 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Comments Overview Product Name PCB Headers 44428 Board-to-Board, Wire-to-Board High Temperature|Square Pin|Solder Type|Polarized to Mating Part microfit_30 Micro-Fit 3.0 BMI™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) No 16 16 Black 30 No 94V-0 No No None Yes Brass Gold Tin High Temperature Thermoplastic 2 Right Angle 0.138 In 3.50 mm Yes Yes 0.062 In 1.60 mm Tray 0.118 In 3.00 mm 15 0.38 100 2.54 Search Parts in this Series 44428Series Mates With 44133 , 44764 , 44769 Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style Yes Fully No Yes -40°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 Wave Capable (TH only) 1 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-44428-001 PS-44300-001, RPS-44300-001 SD-44428-001 This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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0444281605

1. 物料型号： - 型号：0444281605 - 系列：44428

2. 器件简介： - 产品名称：Micro-Fit 3.0 BMITM - 描述：3.00mm (.118") 间距 Micro-Fit 3.0 BMITM 双排、直角、无卡扣塑料柱PCB锁，16电路，0.38um (15)。

3. 引脚分配： - 最大电路数：16 - 引脚间距：3.00mm (0.118英寸)

4. 参数特性： - 颜色 - 树脂耐用性（最大插拔次数）：黑色，30次 - 阻燃性：94V-0 - 焊接兼容性：无铅焊接，最大承受温度260°C，最大周期数为5次

5. 功能详解： - 应用：板对板、线对板连接 - 特点：高温、方头、焊接类型为极化

6. 应用信息： - 与44133、44764、44769型号相匹配 - 极化到PCB、带护罩、堆叠式、表面贴装兼容

7. 封装信息： - 封装类型：直角 - PCB厚度推荐：0.062英寸（1.60mm） - 引脚间距：3.00mm（0.118英寸） - 金属材质：黄铜 - 镀层：接触区域为金，镀层最小厚度0.38um（15uin），终止区域最小厚度2.54um（100uin）

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