0444321601

厂商：
MOLEX6
封装：
描述：
0444321601 - 3.00mm (.118") Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Vert...

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0444321601 数据手册

This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0444321601 Active microfit_30 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 16 Circuits, Tin (Sn) Plating Documents: 3D Model Drawing (PDF) Product Specification PS-44300-001 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 R72081037 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA TUV UL General Product Family Series Application Comments Overview Product Literature Order No Product Name PCB Headers 44432 Board-to-Board, Wire-to-Board High Temperature|Square Pin|Offset Through Hole Mounting|Solder Type microfit_30 USA-106 Micro-Fit 3.0 BMI™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) No 16 16 Black 30 94V-0 No Brass Tin Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm Yes Yes 0.062 In 1.60 mm Tray 0.118 In 3.00 mm 200 5 200 5 Yes Fully No Yes Search Parts in this Series 44432Series Mates With 44133 , 44764 , 44769 Temperature Range - Operating Termination Interface: Style -40°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 Wave Capable (TH only) 1 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-44432-001 PS-44300-001, RPS-44300-001 SD-44432-001 This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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0444321601

1. 物料型号： - 型号：0444321601 - 状态：Active - 描述：3.00mm (.118") Pitch Micro-Fit 3.0 BMTM Header, Surface Mount compatible, Dual Row, Vertical, with PCB Polarizing Peg, 16 Circuits, Tin (Sn) Plating

2. 器件简介： - 产品家族：PCB Headers - 系列：44432 - 应用：Board-to-Board, Wire-to-Board - 评论：High Temperature, Square Pin Offset Through Hole - 产品名称：Micro-Fit 3.0 BMITM

3. 引脚分配： - 电路（已加载）：16 - 最大电路数：16 - 引脚间距：3.00mm (0.118") 4. 参数特性： - 耐用性（最大插拔次数）：30 - 耐燃性：94V-0 - 金属材质：黄铜 - 镀层：锡 - 树脂材料：高温热塑性塑料 - 排数：2 - 极化到PCB：是 - 堆叠：否 - 表面贴装兼容（SMC）：是

5. 功能详解： - 该器件为Micro-Fit 3.0系列的BMTM Header，具有双排、垂直方向、与PCB极化配合的特点。适用于板对板、线对板的应用场景，具有较高的耐温性能和方销偏移的直插式设计。

6. 应用信息： - 适用于高温环境，方销偏移设计适用于直插式应用。

7. 封装信息： - 封装类型：Tray - 推荐PCB厚度：0.062" (1.60mm) - 引脚间距：3.00mm (0.118") - 镀层最小厚度：Mating (uin) 200，Termination (uin) 200

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