0475940002

厂商：
MOLEX6
封装：
描述：
0475940002 - 1.016mm (.040") by 1.016mm (.040") Pitch LGA 1366 Server CPU Socket, 0.76um (30u") Gold...

数据手册：

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0475940002 数据手册

This document was generated on 05/17/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0475940002 Active 1.016mm (.040") by 1.016mm (.040") Pitch LGA 1366 Server CPU Socket, 0.76µm (30µ") Gold(Au) Plating, 1366 Circuits, Lead-free Documents: 3D Model Drawing (PDF) Product Specification PS-47594-001 (PDF) RoHS Certificate of Compliance (PDF) Series Processor Sockets 47594 Socket LGA1366 image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Component Type Product Name Physical Circuits (Loaded) Color - Resin Durability (mating cycles max) Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Temperature Range - Operating Termination Interface: Style 1366 Black 30 Copper Alloy Gold Nickel High Temperature Thermoplastic Tray 0.040 In 1.02 mm 0.04 1.02 30 0.76 -40°C to +88°C Solder or Weld Electrical Current - Maximum per Contact Voltage - Maximum 0.8A 5V Search Parts in this Series 47594Series Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 3 Reflow Capable (SMT only) 1 250 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing Test Summary PK-47594-001, PK-47594-003 PS-47594-001 SD-47594-001, SD-47594-002 TS-47594-001 This document was generated on 05/17/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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0475940002

1. 物料型号： - Part Number: 0475940002

2. 器件简介： - Description: (30") Gold(Au) Plating, 1366 Circuits, Lead-free 1.016mm (0.040) by 1.016mm (0.040") Pitch LGA 1366 Server CPU Socket, 0.76

3. 引脚分配： - Circuits (Loaded): 1366

4. 参数特性： - 材料 - 金属：Copper Alloy（铜合金） - 材料 - 镀层接触：Gold（金） - 材料 - 镀层终止：Nickel（镍） - 材料 - 树脂：High Temperature Thermoplastic（高温热塑性塑料） - 包装类型：Tray（托盘） - 配对接口间距（英寸）：0.040 In - 配对接口间距（毫米）：1.02 mm - 镀层最小值：接触（微英寸）：0.04 - 镀层最小值：接触（微米）：1.02 - 镀层最小值：终止（微英寸）：30 - 镀层最小值：终止（微米）：0.76 - 工作温度范围：-40°C to +88°C

5. 功能详解： - 该文档描述的是一个LGA 1366服务器CPU插座，具有1366个电路，无铅，金镀层，适用于服务器CPU。

6. 应用信息： - 产品适用于服务器CPU的插座。

7. 封装信息： - 封装类型：Tray（托盘） - 配对接口间距：0.040英寸或1.02毫米 - 镀层厚度：接触区域最小0.04微英寸（1.02微米），终止区域最小30微英寸（0.76微米）

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