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43650-0525

43650-0525

  • 厂商:

    MOLEX6

  • 封装:

  • 描述:

    43650-0525 - 3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Single Row,Vertic...

  • 详情介绍
  • 数据手册
  • 价格&库存
43650-0525 数据手册
This document was generated on 05/26/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0436500525 Active microfit_30 3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Single Row, Vertical, with Solder Tab, 5 Circuits, 0.38µm (15µ") Gold (Au) Selective Plating, Glow Wire Compatible Documents: 3D Model Drawing (PDF) Product Specification PS-43650 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA TUV UL LR19980 R72081037 E29179 General Product Family Series Application Comments Overview Product Literature Order No Product Name PCB Headers 43650 Wire-to-Board High Temperature|Square Pin|Solder Type microfit_30 USA-106 Micro-Fit 3.0™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Mated Height (in) Mated Height (mm) Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Shrouded Stackable Temperature Range - Operating No 5 5 Black 30 94V-0 Yes 0.680 In 17.27 mm Brass Gold, Tin Tin High Temperature Thermoplastic 1 Vertical Yes Yes 0.062 In 1.60 mm Embossed Tape on Reel 0.118 In 3.00 mm 15.2, 35 0.38, 0.88 100, 35 0.88, 2.5 Yes Fully No -40°C to +105°C Search Parts in this Series 43650Series Mates With 43645 Micro-Fit 3.0™ Receptacle Housing Termination Interface: Style Surface Mount Electrical Current - Maximum per Contact Voltage - Maximum 5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 30 Reflow Capable (SMT only) 3 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing Test Summary PK-70873-07** PS-43650 SD-43650-009 TS-43045-002 This document was generated on 05/26/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
43650-0525
1. 物料型号: - 型号:0436500525

2. 器件简介: - 产品系列:PCB Headers - 应用系列:43650 Wire-to-Board - 描述:Micro-Fit 3.0™,垂直安装,带焊接板,5电路,0.38um(15u")金(Au)选择性电镀。

3. 引脚分配: - 电路(已加载):5 - 电路(最大):5

4. 参数特性: - 耐用性(最大插拔次数):30 - 阻燃等级:94V-0 - 符合防火测试:是 - 配合高度(英寸):0.680 In - 配合高度(毫米):17.27mm - 金属材质:黄铜 - 镀层:配合-金、锡;终止-锡 - 树脂材质:耐高温热塑性塑料 - 排数:1 - 方向:垂直 - PCB定位:是 - PCB固定:是 - 推荐PCB厚度(英寸):0.062 In - 推荐PCB厚度(毫米):1.60 mm - 配合界面间距(英寸):0.118 In - 配合界面间距(毫米):3.00 mm - 镀层最小:配合(uin):15.2,35 - 镀层最小:配合(um):0.38, 0.88 - 镀层最小:终止(uin):100,35 - 镀层最小:终止(um):0.88, 2.5 - 与PCB极性化:是 - 全覆盖:完全 - 可堆叠:否 - 工作温度范围:-40°C至+105°C

5. 功能详解: - 与43645 Micro-Fit 3.0™插座housing配合使用。

6. 应用信息: - 电性:每个接触点最大电流5A,最大电压250V。 - 焊接过程数据:在最高过程温度下持续时间30秒,无铅过程能力(仅限SMT),最大过程温度下的周期数3,最高过程温度260°C。

7. 封装信息: - 封装类型:浮雕胶带卷装。 - 配合界面间距:0.118英寸(3.00毫米)。
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