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43650-0718

43650-0718

  • 厂商:

    MOLEX6

  • 封装:

  • 描述:

    43650-0718 - 3.00mm (.118") Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertic...

  • 详情介绍
  • 数据手册
  • 价格&库存
43650-0718 数据手册
This document was generated on 05/26/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0436500718 Active microfit_30 3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Single Row, Vertical, with Press-fit Metal Retention Clip, 7 Circuits, Tin (Sn) Plating, Glow Wire Compatible Documents: 3D Model Packaging Specification (PDF) Drawing (PDF) Product Specification PS-43650 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA TUV UL LR19980 R72081037 E29179 General Product Family Series Application Comments Overview Product Literature Order No Product Name PCB Headers 43650 Wire-to-Board High Temperature|Square Pin|Offset Through Hole Mounting|Solder Type microfit_30 USA-106 Micro-Fit 3.0™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Mated Height (in) Mated Height (mm) Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Shrouded No 7 7 Black 30 94V-0 Yes 0.680 In 17.27 mm Brass Tin Tin High Temperature Thermoplastic 1 Vertical Yes Yes 0.062 In 1.60 mm Tray 0.118 In 3.00 mm 100 2.5 100 2.5 Yes Fully Search Parts in this Series 43650Series Mates With 43645 Micro-Fit 3.0™ Receptacle Housing Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No Yes -40°C to +105°C Through Hole - Kinked Pin Electrical Current - Maximum per Contact Voltage - Maximum 5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 30 SMC & Wave Capable (TH only) 3 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0811 PS-43650 SD-43650-007 This document was generated on 05/26/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
43650-0718
1. 物料型号: - 型号:0436500718 - 状态:Active(活跃) - 描述:3.00mm (.118") 间距 Micro-Fit 3.0™ 公头,表面贴装兼容,单排,垂直,带压配合金属保持夹,7电路,锡(Sn)镀层,灼热丝测试。

2. 器件简介: - 产品系列:43650 - 应用:线对板(Wire-to-Board) - 评论:全球适用,高温,方针,偏置通孔 - 产品名称:Micro-Fit 3.0™ - 物理特性:无断裂,7个电路(最大也是7),黑色树脂,耐温30次,94V-0阻燃等级,灼热丝测试合格,材料为黄铜,镀锡,高温热塑性塑料。

3. 引脚分配: - 电路数(已加载):7 - 电路数(最大):7

4. 参数特性: - 耐温:-40°C至+105°C - 电气最大电流每接触:5A - 电气最大电压:250V - 焊接过程数据:无铅焊接,最大周期260次,最高处理温度(秒)3。

5. 功能详解: - 垂直方向,PCB定位器,PCB保持,推荐PCB厚度为0.062英寸(1.60mm),引脚间距为0.118英寸(3.00mm),镀层最小厚度为100微英寸(2.5微米)。

6. 应用信息: - 与43645 Micro-Fit 3.0™ 插座外壳兼容,可堆叠表面贴装兼容(SMC)。

7. 封装信息: - 封装类型:Tray(托盘) - 引脚间距:3.00mm - 极化到PCB:是 - 护套:全护套
43650-0718 价格&库存

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