43650-0820

厂商：
MOLEX6
封装：
描述：
43650-0820 - 3.00mm (.118") Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertic...

数据手册：

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43650-0820 数据手册

This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0436500820 Active microfit_30 3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Single Row, Vertical, with Press-fit Metal Retention Clip, 8 Circuits, 0.76µm (30µ") Gold (Au) Selective Plating, Glow Wire Compatible Documents: 3D Model Drawing (PDF) Packaging Specification (PDF) Product Specification PS-43650 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA TUV UL LR19980 R72081037 E29179 General Product Family Series Application Comments Overview Product Literature Order No Product Name PCB Headers 43650 Wire-to-Board High Temperature|Square Pin|Offset Through Hole Mounting|Solder Type microfit_30 USA-106 Micro-Fit 3.0™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Mated Height (in) Mated Height (mm) Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Shrouded No 8 8 Black 30 94V-0 Yes 0.680 In 17.27 mm Brass Gold Tin High Temperature Thermoplastic 1 Vertical Yes Yes 0.062 In 1.60 mm Tray 0.118 In 3.00 mm 30 0.75 100 2.5 Yes Fully Search Parts in this Series 43650Series Mates With 43645 Micro-Fit 3.0™ Receptacle Housing Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No Yes -40°C to +105°C Through Hole - Kinked Pin Electrical Current - Maximum per Contact Voltage - Maximum 5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 30 SMC & Wave Capable (TH only) 3 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing Test Summary PK-70873-0811 PS-43650 SD-43650-007 TS-43045-002 This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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43650-0820

1. 物料型号： - 型号：0436500820 - 状态：Active - 描述：microfit_30 Selective Plating, Glow Wire Compatible, 3.00mm (.118") Pitch Micro-Fit 3.0TM Header, Surface Mount Compatible, Single Row, Vertical, with Press-fit Metal Retention Clp, 8 Circuits, 0.76um (30") Gold (Au)

2. 器件简介： - 产品系列：43650 - 应用：Wire-to-Board - 评论：High Temperature, Square Pin, Offset Through Hole - 产品名称：Micro-Fit 3.0TM - 物理特性：无断裂，8个电路（最大），黑色树脂，耐用性30次，94V-0阻燃等级，通过Glow-Wire测试。

3. 引脚分配： - 引脚数量：8个电路 - 引脚间距：3.00mm (0.118") 4. 参数特性： - 金属材质：黄铜 - 镀层：金（接触区域）和锡（终止区域） - 树脂材质：高温热塑性塑料 - 行数：1 - 方向：垂直 - PCB厚度推荐：0.062" (1.60mm) - 引脚间距：3.00mm (0.118") - 镀层厚度：接触区域最小30um，终止区域最小2.5um

5. 功能详解： - 该连接器为Wire-to-Board应用，具有高温性能，方头引脚，偏置通孔设计。 - 具有极化到PCB的功能，完全遮蔽。

6. 应用信息： - 适用于-40°C至+105°C的工作温度范围。 - 可通过电子发烧友网站和华强PCB网站了解更多信息。

7. 封装信息： - 封装类型：Tray - 引脚间距：3.00mm (0.118") - 与43645系列的Micro-Fit 3.0™ Receptacle Housing兼容。

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