43650-0911

厂商：
MOLEX6
封装：
描述：
43650-0911 - 3.00mm (.118") Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Right ...

数据手册：

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43650-0911 数据手册

This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0436500911 Active microfit_30 3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Single Row, Right Angle, with PCB Press-fit Metal Retention Clip, 9 Circuits, 0.76µm (30µ") Gold (Au) Selective Plating, Glow Wire Compatible Documents: 3D Model Drawing (PDF) Product Specification PS-43650 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series Agency Certification CSA TUV UL LR19980 R72081037 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Comments Overview Product Literature Order No Product Name PCB Headers 43650 Wire-to-Board High Temperature|Square Pin|Solder Type microfit_30 USA-106 Micro-Fit 3.0™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Mated Height (in) Mated Height (mm) Material - Plating Mating Material - Plating Termination Number of Rows Orientation PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Shrouded Stackable Temperature Range - Operating Termination Interface: Style No 9 9 Black 30 94V-0 Yes 0.275 In 6.98 mm Gold Tin 1 Right Angle Yes Yes 0.062 In 1.60 mm Embossed Tape on Reel 0.118 In 3.00 mm 30 0.76 100 2.50 Yes Fully No -40°C to +105°C Surface Mount Search Parts in this Series 43650Series Mates With 43645 Micro-Fit 3.0™ Receptacle Housing Electrical Current - Maximum per Contact Voltage - Maximum 5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 30 Reflow Capable (SMT only) 3 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing Test Summary PK-70873-07** PS-43650 SD-43650-004 TS-43045-002 This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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43650-0911

1. 物料型号： - 型号：0436500911 - 状态：Active（活跃）

2. 器件简介： - 描述：3.00mm（.118"）间距Micro-Fit 3.0™公头，兼容表面贴装，单排直角，带有PCB压接金属保持夹，9路，0.76um（30"（Au）选择性镀金，灼热丝兼容。

3. 引脚分配： - 电路（已加载）：9 - 电路（最大）：9

4. 参数特性： - 颜色 - 树脂：黑色 - 耐用性（最大插拔次数）：30 - 阻燃性：94V-0 - 灼热丝合规的配合高度（英寸）：是 0.275英寸 - 配合高度（毫米）：6.98毫米 - 材料 - 镀层配合：请访问hip.com - 材料 - 镀层终止：金锡 - 行数：1 - 方向：直角 - PCB定位器：是 - PCB保持：是 - 推荐的PCB厚度（英寸）：0.062英寸 - 推荐的PCB厚度（毫米）：1.60毫米 - 封装类型：卷装浮雕胶带 - 配合界面间距（英寸）：0.118英寸 - 配合界面间距（毫米）：3.00毫米 - 镀层最小：配合（uin）：30 - 镀层最小：配合（um）：0.76 - 镀层最小：终止（uin）：100 - 镀层最小：终止（um）：2.50 - 极化到PCB：是 - 护套：全护套 - 可堆叠：否 - 工作温度范围：-40°C至+105°C - 终止界面：风格 - 表面贴装

5. 功能详解： - 产品家族：PCB公头 - 系列：43650 - 应用：线对板 - 注释：高温|方头焊型

6. 应用信息： - 与43645 Micro-Fit 3.0™插座外壳配合使用

7. 封装信息： - 封装类型：卷装浮雕胶带 - 配合界面间距：3.00mm（0.118英寸）

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