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43650-1009

43650-1009

  • 厂商:

    MOLEX6

  • 封装:

  • 描述:

    43650-1009 - 3.00mm (.118") Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Right ...

  • 详情介绍
  • 数据手册
  • 价格&库存
43650-1009 数据手册
This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0436501009 Active microfit_30 3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Single Row, Right Angle, with PCB Press-fit Metal Retention Clip, 10 Circuits, Tin (Sn) Plating, Glow Wire Compatible Documents: 3D Model Drawing (PDF) Product Specification PS-43650 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series Agency Certification CSA TUV UL LR19980 R72081037 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Comments Overview Product Literature Order No Product Name PCB Headers 43650 Wire-to-Board Glow Wire Equivalent Part Number 436501009. High Temperature, Square Pin, Solder Type microfit_30 USA-106 Micro-Fit 3.0™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Mated Height (in) Mated Height (mm) Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Shrouded Stackable No 10 10 Black 30 94V-0 Yes 0.275 In 6.98 mm Brass Tin Tin High Temperature Thermoplastic 1 Right Angle Yes Yes 0.062 In 1.60 mm Embossed Tape on Reel 0.118 In 3.00 mm 100 2.50 100 2.50 Yes Fully No Search Parts in this Series 43650Series Mates With 43645 Micro-Fit 3.0™ Receptacle Housing Temperature Range - Operating Termination Interface: Style -40°C to +105°C Surface Mount Electrical Current - Maximum per Contact Voltage - Maximum 5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 30 Reflow Capable (SMT only) 3 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-07** PS-43650 SD-43650-004 This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
43650-1009
1. 物料型号: - 型号:0436501009 - 状态:Active(活跃)

2. 器件简介: - 产品名称:Micro-Fit 3.0™ - 描述:3.00mm (.118") 间距 Micro-Fit 3.0™ 直角头,兼容表面贴装,单排,带有PCB压配合金属保持夹,10路,锡(Sn)镀层,灼热丝兼容。

3. 引脚分配: - 已装填电路数:10 - 最大电路数:10

4. 参数特性: - 颜色 - 树脂:黑色 - 耐用性(最大插拔次数):30 - 阻燃性:94V-0 - 灼热丝合规性:是 - 配合高度(英寸):0.275 In - 配合高度(毫米):6.98 mm - 材料 - 金属:黄铜 - 材料 - 镀层:配合锡,终止锡 - 材料 - 树脂:耐高温热塑性塑料 - 行数:1 - 方向:直角 - PCB定位:是 - PCB保持:是 - 推荐PCB厚度(英寸):0.062 In - 推荐PCB厚度(毫米):1.60 mm - 包装类型:卷装浮雕胶带 - 配合界面间距(英寸):0.118 In - 配合界面间距(毫米):3.00 mm - 镀层最小:配合(微英寸):100 - 镀层最小:配合(微米):2.50 - 镀层最小:终止(微英寸):100 - 镀层最小:终止(微米):2.50 - 极化到PCB:是 - 全封闭:完全 - 可堆叠:否

5. 功能详解: - 与43645 Micro-Fit 3.0™ 插座外壳配合使用。

6. 应用信息: - 产品家族:PCB头 - 系列:43650 - 应用:线对板

7. 封装信息: - 电气:每接触最大电流5A,最大电压250V - 焊接过程数据:回流焊能力(SMT仅)3 260,无铅工艺能力,最大过程温度下的最大周期数,最大过程温度C
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