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44067-0403

44067-0403

  • 厂商:

    MOLEX6

  • 封装:

  • 描述:

    44067-0403 - 3.00mm (.118") Pitch Micro-Fit 3.0™ Wire-to-Board Header, Dual Row, Vertical for up to ...

  • 详情介绍
  • 数据手册
  • 价格&库存
44067-0403 数据手册
This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0440670403 Active microfit_30 3.00mm (.118") Pitch Micro-Fit 3.0™ Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 4 Circuits, 0.76µm (30µ") Gold (Au) Selective Plating Documents: 3D Model Drawing (PDF) Product Specification PS-43045 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only PCB Headers 44067 Wire-to-Board High Temperature, Polarization Key to PCB microfit_30 Micro-Fit 3.0™ EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Comments Overview Product Name Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No 4 4 Black 30 No No No None Yes Gold Tin High Temperature Thermoplastic 2 Vertical 0.158 In 4.01 mm Yes Yes 0.140 In 3.60 mm Tray 0.118 In 3.00 mm 0.118 In 3.00 mm 30 0.75 100 2.5 Yes Fully No Yes -40°C to +105°C Through Hole - Kinked Pin Search Parts in this Series 44067Series Mates With 43025 Micro-Fit™ Header Electrical Current - Maximum per Contact Voltage - Maximum 5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 30 SMC & Wave Capable (TH only) 3 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing Test Summary PK-70873-0314 PS-43045 SD-44067-001 TS-43045-002 This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
44067-0403
物料型号: - 型号:0440670403 - 状态:Active(活跃)

器件简介: - 产品家族:PCB Headers(PCB插座) - 系列:44067 - 应用:Wire-to-Board(线对板) - 评论:适用于高温环境,带有极化键以适配PCB - 产品名称:Micro-Fit 3.0™

引脚分配: - 电路(已加载):4 - 最大电路数:4

参数特性: - 颜色 - 树脂:黑色 - 耐用性(最大插拔次数):30 - 无先导/最后断裂 - 不符合灼热丝测试 - 无导向至配合部件 - 无键控至配合部件 - 锁扣至配合部件:是 - 配合部件镀层材料:金 - 终止镀层材料:锡 - 树脂材料:高温热塑性塑料 - 行数:2 - 方向:垂直 - PCB尾部长度:0.158英寸(4.01毫米) - PCB定位器:是 - PCB保持:是 - 推荐的PCB厚度:0.140英寸(3.60毫米) - 包装类型:托盘 - 配合界面间距:0.118英寸(3.00毫米) - 终止界面间距:0.118英寸(3.00毫米) - 配合镀层最小值:0.75微米(30微英寸) - 终止镀层最小值:2.5微米(100微英寸) - 极化至PCB:是 - 全封闭:是 - 可堆叠:否 - 表面贴装兼容(SMC):是 - 工作温度范围:-40°C至+105°C - 终止接口样式:通孔 - 弯曲销钉

功能详解: - 该连接器适用于线对板连接,具有高温耐受性和极化键以确保正确连接。它还具有锁扣机制以确保连接的稳定性。

应用信息: - 适用于需要高温耐受和极化连接的应用场合。

封装信息: - 封装类型:通孔 - 弯曲销钉 - 封装材料:高温热塑性塑料 - 封装颜色:黑色
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