44067-0602

44067-0602

  • 厂商:

    MOLEX6

  • 封装:

  • 描述:

    44067-0602 - 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3...

  • 详情介绍
  • 数据手册
  • 价格&库存
44067-0602 数据手册
This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0440670602 Active microfit_30 3.00mm (.118") Pitch Micro-Fit 3.0™ Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 6 Circuits, 0.38µm (15µ") Gold (Au) Selective Plating Documents: 3D Model Drawing (PDF) Product Specification PS-43045 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only PCB Headers 44067 Wire-to-Board High Temperature, Polarization Key to PCB microfit_30 Micro-Fit 3.0™ EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Comments Overview Product Name Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No 6 6 Black 30 No No No None Yes Gold Tin High Temperature Thermoplastic 2 Vertical 0.158 In 4.01 mm Yes Yes 0.140 In 3.60 mm Tray 0.118 In 3.00 mm 0.118 In 3.00 mm 15 0.375 100 2.5 Yes Fully No Yes -40°C to +105°C Through Hole - Kinked Pin Search Parts in this Series 44067Series Mates With 43025 Micro-Fit™ Header Electrical Current - Maximum per Contact Voltage - Maximum 5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 30 SMC & Wave Capable (TH only) 3 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing Test Summary PK-70873-0314 PS-43045 SD-44067-001 TS-43045-002 This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
44067-0602
1. 物料型号: - 型号:0440670602 - 状态:Active(活跃)

2. 器件简介: - 产品系列:44067 - 应用:Wire-to-Board(线对板) - 描述:3.00mm(.118")间距Micro-Fit 3.0™线对板头,双排,垂直式,适用于3.56mm(.140")厚的PCB,6路,0.38µm(15µ")金(Au)选择性镀层。

3. 引脚分配: - 电路(已加载):66 - 电路(最大):未提供 - 引脚数量:2排

4. 参数特性: - 颜色 - 树脂:黑色 - 耐用性(最大插拔次数):30 - 焊接兼容性:无 - 耐热性:是 - 锁扣与配合件:是 - 镀层材质 - 配合件:金 - 镀层材质 - 终止:锡 - 材质 - 树脂:高温热塑性塑料 - 排数:2 - 方向:垂直 - PCB厚度推荐(英寸):0.140 - PCB厚度推荐(毫米):3.60 - 包装类型:托盘 - 间距 - 配合界面(英寸):0.118 - 间距 - 配合界面(毫米):3.00 - 镀层最小:配合(uin):15 - 镀层最小:配合(um):0.375 - 镀层最小:终止(uin):100 - 镀层最小:终止(um):2.5 - 极化到PCB:是 - 屏蔽:完全 - 堆叠:否 - 表面安装兼容(SMC):是 - 工作温度范围:-40°C至+105°C - 终止界面:通孔 - 弯曲销

5. 功能详解: - 该产品为线对板连接器,具有高温、极化键到PCB的特点,适用于需要高插拔次数和高温环境的应用。

6. 应用信息: - 适用于线对板连接,特别是在需要高温和极化键的应用中。

7. 封装信息: - 封装类型:通孔 - 弯曲销 - 封装材料:高温热塑性塑料 - 封装颜色:黑色
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