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44428-0603

44428-0603

  • 厂商:

    MOLEX6

  • 封装:

  • 描述:

    44428-0603 - 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Rig...

  • 详情介绍
  • 数据手册
  • 价格&库存
44428-0603 数据手册
This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0444280603 Active microfit_30 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 6 Circuits, 0.76µm (30µ") Gold (Au) Selective Plating Documents: 3D Model Drawing (PDF) Product Specification PS-44300-001 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series Agency Certification CSA TUV UL LR19980 R72081037 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Comments Overview Product Literature Order No Product Name PCB Headers 44428 Board-to-Board, Wire-to-Board High Temperature|Square Pin|Solder Type|Polarized to Mating Part microfit_30 USA-106 Micro-Fit 3.0 BMI™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) No 6 6 Black 30 No 94V-0 No No None Yes Brass Gold Tin High Temperature Thermoplastic 2 Right Angle 0.138 In 3.50 mm Yes Yes 0.062 In 1.60 mm Tray 0.118 In 3.00 mm 30 0.76 100 Search Parts in this Series 44428Series Mates With 44133 , 44764 , 44769 Plating min: Termination (µm) Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 2.54 Yes Fully No Yes -40°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 Wave Capable (TH only) 1 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-44428-001 PS-44300-001, RPS-44300-001 SD-44428-001 This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
44428-0603
1. 物料型号: - 型号:0444280603 - 状态:Active(活跃)

2. 器件简介: - 描述:3.00mm (.118") 间距 Micro-Fit 3.0 BMI™ 公头,兼容表面贴装,双排,直角,带卡入式塑料卡PCB锁,6路,0.76µm (30µ") 金(Au)选择性镀金。 - 文档:3D模型、产品规格书PS-44300-001(PDF)、图纸(PDF)、RoHS合规证书(PDF)。

3. 引脚分配: - 电路(已加载):6路 - 最大电路数:6路 - 引脚间距:3.00mm(0.118英寸)

4. 参数特性: - 耐热性:高 - 引脚形状:方形 - 焊接类型:极化 - 配合部件:microfit_30 - 耐久性(最大插拔次数):30次 - 阻燃性:94V-0

5. 功能详解: - 该产品为Micro-Fit 3.0 BMI™系列,具有高耐热性、方形引脚和极化焊接特性,适用于板对板、线对板的应用。

6. 应用信息: - 应用:板对板、线对板 - 工作温度范围:-40°C至+105°C

7. 封装信息: - 封装类型:Tray(托盘) - 配合接口间距:3.00mm(0.118英寸) - 镀金厚度:最小0.76µm(30µ") - 端子镀金厚度:最小1µin(0.025µm) - 锡镀层:最小0.00005"(0.00127mm)
44428-0603 价格&库存

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