44432-0803

厂商：
MOLEX6
封装：
描述：
44432-0803 - 3.00mm (.118") Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Vert...

数据手册：

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44432-0803 数据手册

This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0444320803 Active microfit_30 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 8 Circuits, 0.76µm (30µ") Gold (Au) Selective Plating Documents: 3D Model Drawing (PDF) Product Specification PS-44300-001 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series Agency Certification CSA TUV UL LR19980 R72081037 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Comments Overview Product Literature Order No Product Name PCB Headers 44432 Board-to-Board, Wire-to-Board High Temperature|Square Pin|Offset Through Hole Mounting|Solder Type microfit_30 USA-106 Micro-Fit 3.0 BMI™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Shrouded Stackable No 8 8 Black 30 94V-0 No Brass Gold Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm Yes Yes 0.062 In 1.60 mm Tray 0.118 In 3.00 mm 30 0.75 100 2.5 Yes Fully No Search Parts in this Series 44432Series Mates With 44133 , 44764 , 44769 Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style Yes -40°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 Wave Capable (TH only) 1 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-44432-001 PS-44300-001, RPS-44300-001 SD-44432-001 This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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44432-0803

1. 物料型号： - 型号：0444320803 - 状态：Active - 系列：44432

2. 器件简介： - 描述：3.00mm (.118) Pitch Micro-Fit 3.0 BMITM Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 8 Circuits, 0.76um (30 ") Gold (Au) Selective - 产品家族：Micro-Fit 3.0 BMITM - 应用：Board-to-Board, Wire-to-Board

3. 引脚分配： - 电路数（已加载）：8 - 最大电路数：8 - 引脚间距：3.00mm (0.118英寸)

4. 参数特性： - 颜色 - 树脂：黑色 - 耐久性（最大插拔次数）：30 - 阻燃性：94V-0 - 金属材质：黄铜 - 镀层 - 接触：金 - 镀层 - 终止：锡 - 树脂材质：高温热塑性塑料 - 排数：2 - 朝向：垂直 - PCB厚度推荐：0.062英寸（1.60mm）

5. 功能详解： - 该连接器支持高达5A电流和250V电压。 - 焊接过程数据：最大过程温度下持续时间、无铅过程能力、最大周期次数等。

6. 应用信息： - 适用于板对板、线对板连接。 - 工作温度范围：-40°C至+105°C。

7. 封装信息： - 封装类型：Tray - 插拔接口间距：3.00mm (0.118英寸) - 镀层最小：接触3.00um（0.75uin），终止2.5um（100uin）

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