44432-1403

厂商：
MOLEX6
封装：
描述：
44432-1403 - 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Ver...

数据手册：

下载44432-1403.pdf

立即购买

详情介绍
数据手册
价格&库存

44432-1403 数据手册

This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0444321403 Active microfit_30 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 14 Circuits, 0.76µm (30µ") Gold (Au) Selective Plating Documents: 3D Model Drawing (PDF) Product Specification PS-44300-001 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series Agency Certification CSA TUV UL LR19980 R72081037 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Comments Overview Product Literature Order No Product Name PCB Headers 44432 Board-to-Board, Wire-to-Board High Temperature|Square Pin|Offset Through Hole Mounting|Solder Type microfit_30 USA-106 Micro-Fit 3.0 BMI™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Shrouded Stackable No 14 14 Black 30 94V-0 No Brass Gold Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm Yes Yes 0.062 In 1.60 mm Tray 0.118 In 3.00 mm 30 0.75 100 2.5 Yes Fully No Search Parts in this Series 44432Series Mates With 44133 , 44764 , 44769 Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style Yes -40°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 Wave Capable (TH only) 1 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-44432-001 PS-44300-001, RPS-44300-001 SD-44432-001 This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

下载 PDF

44432-1403

1. 物料型号： - 型号：0444321403

2. 器件简介： - 描述：3.00mm (.118") 间距 Micro-Fit 3.0 BMITM 公头，兼容表面贴装，双排，垂直，带PCB极化销，14路，0.76um (30") 金(Au)选择性镀金。

3. 引脚分配： - 电路（已加载）：14路 - 电路（最大）：14路

4. 参数特性： - 颜色 - 树脂：黑色 - 耐用性（最大插拔次数）：30次 - 阻燃性：94V-0 - 材料 - 金属：黄铜 - 材料 - 镀金：金 - 材料 - 镀锡：锡 - 材料 - 树脂：高温热塑性塑料 - 排数：2 - 接口 - 间距（英寸）：0.118英寸 - 接口 - 间距（毫米）：3.00毫米 - 镀金最小厚度（微英寸）：30 - 镀金最小厚度（微米）：0.75 - 镀锡最小厚度（微英寸）：100 - 镀锡最小厚度（微米）：2.5

5. 功能详解： - 应用：板对板、线对板 - 评论：高温方形引脚偏移通孔 - 操作温度范围：-40°C至+105°C - 电气最大电流 - 每接触：5A - 电气最大电压：250V - 焊接过程数据：最大过程温度下持续时间（秒）：波峰焊能力（TH only）1秒260°C，最大周期次数：260次

6. 应用信息： - 与44133、44764、44769兼容 - 表面贴装兼容（SMC）

7. 封装信息： - 包装类型：托盘 - PCB厚度推荐（英寸）：0.062英寸 - PCB厚度推荐（毫米）：1.60毫米

44432-1403 价格&库存

-> 查询更多价格&库存

很抱歉，暂时无法提供与“44432-1403”相匹配的价格&库存，您可以联系我们找货

免费人工找货

搜索历史

44432-1403

相关技术文章