44432-2401

44432-2401

  • 厂商:

    MOLEX6

  • 封装:

  • 描述:

    44432-2401 - 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Ver...

  • 详情介绍
  • 数据手册
  • 价格&库存
44432-2401 数据手册
This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0444322401 Active microfit_30 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 24 Circuits, Tin (Sn) Plating Documents: 3D Model Drawing (PDF) Product Specification PS-44300-001 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 R72081037 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA TUV UL General Product Family Series Application Comments Overview Product Literature Order No Product Name PCB Headers 44432 Board-to-Board, Wire-to-Board High Temperature|Square Pin|Offset Through Hole Mounting|Solder Type microfit_30 USA-106 Micro-Fit 3.0 BMI™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) No 24 24 Black 30 94V-0 No Brass Tin Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm Yes Yes 0.062 In 1.60 mm Tray 0.118 In 3.00 mm 200 5 200 5 Yes Fully No Yes Search Parts in this Series 44432Series Mates With 44133 , 44764 , 44769 Temperature Range - Operating Termination Interface: Style -40°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 Wave Capable (TH only) 1 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-44432-001 PS-44300-001, RPS-44300-001 SD-44432-001 This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
44432-2401
1. 物料型号: - 型号:0444322401 - 状态:Active

2. 器件简介: - 描述:3.00mm (.118) 间距 Micro-Fit 3.0 BMTM 双排直立式头座,兼容表面贴装,带PCB极化销,24路,锡(Sn)镀层。

3. 引脚分配: - 引脚数量:24路(满载)

4. 参数特性: - 耐热性:高温 - 颜色:黑色 - 耐久性:最大30次插拔 - 阻燃等级:94V-0 - 材料:黄铜镀锡,终止镀锡 - 行数:2 - 极化:对PCB有极化 - 屏蔽:全屏蔽 - 表面贴装兼容:是

5. 功能详解: - 该器件为Micro-Fit 3.0系列的BMTM头座,具有高耐热性和良好的电气性能,适用于板对板、线对板的应用。

6. 应用信息: - 应用:板对板、线对板连接 - 工作温度范围:-40°C至+105°C

7. 封装信息: - 封装类型:Tray(托盘) - 间距:3.00mm(接口) - PCB厚度推荐:0.062英寸(1.60mm) - 焊接尾长:0.130英寸(3.30mm)
44432-2401 价格&库存

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